Patent Assignment Details
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| Reel/Frame: | 025805/0826 | |
| Pages: | 4 |
| | Recorded: | 02/14/2011 | | |
| Attorney Dkt #: | GUA-0171-LE |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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03/19/2013
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Application #:
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13026963
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Filing Dt:
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02/14/2011
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Publication #:
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Pub Dt:
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08/25/2011
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Title:
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METHOD FOR FORMING PAD IN WAFER WITH THREE-DIMENSIONAL STACKING STRUCTURE
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Assignee
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| 19F, DAECHI TOWER B/D, #891 |
| DAECHI-DONG, GANGNAM-GU |
| SEOUL, KOREA, REPUBLIC OF |
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Correspondence name and address
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JAE Y. PARK
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KILE PARK GOEKJIAN REED & MCMANUS PLLC
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1200 NEW HAMPSHIRE AVE. NW, SUITE 570
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WASHINGTON, DC 20036
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