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Patent Assignment Details
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Reel/Frame:019342/0827   Pages: 3
Recorded: 05/08/2007
Attorney Dkt #:LEET.0025
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
NONE
Issue Dt:
Application #:
11797874
Filing Dt:
05/08/2007
Publication #:
Pub Dt:
11/15/2007
Title:
Method of soldering component to substrate and electronic device made by the same
Assignors
1
Exec Dt:
03/14/2007
2
Exec Dt:
03/14/2007
3
Exec Dt:
03/14/2007
4
Exec Dt:
03/26/2007
Assignee
1
6, FENG-SHU TSUEN, GUEISHAN
TAOYUAN 333, TAIWAN R.O.C.
Correspondence name and address
STANLEY P. FISHER
REED SMITH LLP
3110 FAIRVIEW PARK DR.
SUITE 1400
FALLS CHURCH, VA 22042

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