Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 057542/0827 | |
| Pages: | 7 |
| | Recorded: | 09/20/2021 | | |
| Attorney Dkt #: | 293/1205_00 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17479284
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Filing Dt:
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09/20/2021
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Publication #:
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Pub Dt:
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04/14/2022
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Title:
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CMP SLURRY COMPOSITION FOR POLISHING TUNGSTEN PATTERN WAFER AND METHOD OF POLISHING TUNGSTEN PATTERN WAFER USING THE SAME
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Assignee
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| 150-20, GONGSE-RO, GIHEUNG-GU |
| YONGIN-SI, GYEONGGI-DO,, KOREA, REPUBLIC OF 17084 |
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Correspondence name and address
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LEE IP LAW P.C.
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3141 FAIRVIEW PARK DRIVE SUITE 500
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SUITE 500
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FALLS CHURCH, VA 22042
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05/27/2024 01:00 AM
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