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Patent Assignment Details

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Reel/Frame:	023044/0828			Pages:	4
		Recorded:	08/05/2009
Attorney Dkt #:	1998P01429US
Conveyance:	ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).

Total properties: 13

Patent #:	5203659	Issue Dt:	04/20/1993	Application #:	07896495	Filing Dt:	06/02/1992
Title:	DIE PRESENTATION SYSTEM FOR DIE BONDER

Patent #:	5502890	Issue Dt:	04/02/1996	Application #:	08307749	Filing Dt:	09/26/1994
Title:	PROCESS FOR DETERMINING THE POSITION AND COPLANARITY OF THE LEADS OF COMPONENTS EQUIPPING

Patent #:	5687475	Issue Dt:	11/18/1997	Application #:	08625128	Filing Dt:	04/01/1996
Title:	PROCESS FOR DETERMINING THE POSITION AND/OR CHECKING THE SEPARATION AND/OR CHECKING THE COPLANARITY OF THE LEADS OF COMPONENTS

Patent #:	6064483	Issue Dt:	05/16/2000	Application #:	09093345	Filing Dt:	06/09/1998
Title:	DEVICE FOR CHECKING THE POSITION THE COPLANARITY AND THE SEPARATION OF TERMINALS OF COMPONENTS

Patent #:	6081338	Issue Dt:	06/27/2000	Application #:	09115050	Filing Dt:	07/14/1998
Title:	METHOD AND APPARATUS FOR OPTICALLY CHECKING AN ELECTRICAL COMPONENT AT AN EQUIPPING HEAD

Patent #:	6480223	Issue Dt:	11/12/2002	Application #:	09176361	Filing Dt:	10/21/1998
Title:	"METHOD AND DEVICE FOR DETECTING THE POSITION OF TERMINALS AND/OR EDGE OF COMPONENTS"

Patent #:	6055049	Issue Dt:	04/25/2000	Application #:	09179830	Filing Dt:	10/28/1998
Title:	METHOD AND APPARATUS FOR CALIBRATING A TRAVEL PATH AND/OR AN ANGULAR POSITION OF A HOLDING DEVICE IN A MEANS FOR MANUFACTURING ELECTRICAL ASSEMBLIES AS WELL AS A CALIBRATION SUBSTRATE

Patent #:	6273666	Issue Dt:	08/14/2001	Application #:	09341081	Filing Dt:	07/02/1999
Title:	DEVICE FOR FEEDING ELECTRICAL COMPONENTS INTO INSERTION MACHINES

Patent #:	6574857	Issue Dt:	06/10/2003	Application #:	09807185	Filing Dt:	05/23/2001
Title:	ASSEMBLY DEVICE

Patent #:	7028392	Issue Dt:	04/18/2006	Application #:	09914906	Filing Dt:	09/05/2001
Title:	DEVICE FOR FITTING A SUBSTRATE WITH A FLIP CHIP

Patent #:	7156602	Issue Dt:	01/02/2007	Application #:	10081028	Filing Dt:	02/21/2002
Publication #:	US20030086775	Pub Dt:	05/08/2003
Title:	MECHANISM FOR EXCHANGING CHIP-CARRIER PLATES FOR USE IN A HYBRID CHIP-BONDING MACHINE

Patent #:	NONE	Issue Dt:		Application #:	10220535	Filing Dt:	02/20/2003
Publication #:	US20030159279	Pub Dt:	08/28/2003
Title:	Method and device for determining the pick-up position of electrical components in a component in a components placement device

Patent #:	6786320	Issue Dt:	09/07/2004	Application #:	10358422	Filing Dt:	02/04/2003
Publication #:	US20040099509	Pub Dt:	05/27/2004
Title:	CHIP-TRANSFERRING STATION FOR A BONDING MACHINE

Assignor

Exec Dt:

07/31/2009

Assignee

RUPERT-MAYER-STRASSE 44

MUENCHEN, GERMANY 81379

Correspondence name and address
	SIEMENS CORPORATION
	170 WOOD AVENUE SOUTH
	INTELLECTUAL PROPERTY DEPARTMENT
	ISELIN, NJ 08830

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