Patent Assignment Details
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| Reel/Frame: | 056906/0829 | |
| Pages: | 3 |
| | Recorded: | 07/19/2021 | | |
| Attorney Dkt #: | T93113US01 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17379934
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Filing Dt:
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07/19/2021
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Publication #:
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Pub Dt:
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01/19/2023
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Title:
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HEAT SLUG ATTACHED TO A DIE PAD FOR SEMICONDUCTOR PACKAGE
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Assignee
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| 12500 TI BOULEVARD, M/S 3999 |
| DALLAS, TEXAS 75243 |
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Correspondence name and address
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TEXAS INSTRUMENTS INCORPORATED
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P.O. BOX 655474, M/S 3999
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DALLAS, TX 75265
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05/29/2024 12:14 PM
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