Patent Assignment Details
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Reel/Frame: | 060001/0831 | |
| Pages: | 4 |
| | Recorded: | 05/24/2022 | | |
Attorney Dkt #: | 2019P0655WOUS |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17779383
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Filing Dt:
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05/24/2022
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Publication #:
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Pub Dt:
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12/29/2022
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Title:
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COMBINED MICROSTRUCTURE AND OBJECT BOUNDARY REPRESENTATIONS OF COMPUTER-AIDED DESIGN OBJECTS
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Assignee
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SIR WILLIAM SIEMENS SQUARE |
FRIMLEY |
CAMBERLEY, UNITED KINGDOM GU16 8QD |
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Correspondence name and address
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SIEMENS CORPORATION
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3850 QUADRANGLE BLVD., IP DEPT
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MAIL CODE INT-244
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ORLANDO, FL 32817
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