Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
| Reel/Frame: | 012214/0834 | |
| Pages: | 3 |
| | Recorded: | 09/28/2001 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
|
|
Total properties:
1
|
|
|
|
Patent #:
|
|
Issue Dt:
|
09/09/2003
|
Application #:
|
09964709
|
Filing Dt:
|
09/28/2001
|
|
Publication #:
|
|
Pub Dt:
|
04/10/2003
| | | | |
|
Title:
|
METHOD OF IMPROVING THERMAL PERFORMANCE IN FLIP CHIP/INTEGRAL HEAT SPREADER PACKAGES USING LOW MODULUS THERMAL INTERFACE MATERIAL
|
|
|
Assignee
|
|
|
|
|
| SC4-202 |
| 2200 MISSION COLLEGE BOULEVARD |
| SANTA CLARA, CALIFORNIA 95052 |
|
|
Correspondence name and address
|
| |
ANTONELLI, TERRY, STOUT, KRAUS LLP
|
| |
RONALD J. SHORE
|
| |
SUITE 1800
|
| |
1300 NORTH SEVENTEENTH STREET
|
| |
ARLINGTON, VA 22209
|
Search Results as of:
05/24/2024 10:35 AM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
