Patent Assignment Details
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| Reel/Frame: | 018077/0835 | |
| Pages: | 2 |
| | Recorded: | 07/06/2006 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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08/31/2010
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Application #:
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11481012
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Filing Dt:
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07/06/2006
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Publication #:
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Pub Dt:
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01/18/2007
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Title:
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PACKAGING CHIP HAVING INTERCONNECTION ELECTRODES DIRECTLY CONNECTED TO PLURAL WAFERS
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Assignee
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| 416, MAETAN-DONG, |
| YEONGTONG-GU, SUWON-SI, |
| GYEONGGI-DO, KOREA, REPUBLIC OF |
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Correspondence name and address
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SUGHRUE MION, PLLC
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2100 PENNSYLVANIA AVENUE, N.W.
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SUITE 800
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WASHINGTON, DC 20037
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