Patent Assignment Details
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| Reel/Frame: | 053824/0837 | |
| Pages: | 3 |
| | Recorded: | 09/21/2020 | | |
| Attorney Dkt #: | GBLO025 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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07/19/2022
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Application #:
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17026343
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Filing Dt:
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09/21/2020
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Publication #:
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Pub Dt:
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03/25/2021
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Title:
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SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
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Assignee
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| 105, GEUMIL-RO 965BEON-GIL, |
| EUMSEONG-GUN, CHUNGCHEONGBUK-DO |
| SAMSEONG-MYEON, KOREA, REPUBLIC OF 27651 |
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Correspondence name and address
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GOKALP BAYRAMOGLU
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1540 W. WARM SPRINGS ROAD
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SUITE 100
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HENDERSON, NV 89014
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