Patent Assignment Details
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| Reel/Frame: | 008358/0838 | |
| Pages: | 3 |
| | Recorded: | 02/18/1997 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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06/24/1997
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Application #:
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08437797
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Filing Dt:
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05/09/1995
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Title:
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A METHOD FOR THE 3D INTERCONNECTION OF PACKAGES OF ELECTRONIC COMPONENTS USING PRINTED CIRCUIT BOARDS
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Assignee
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| 173, BOULEVARD HAUSSMANN 75008 |
| PARIS, FRANCE |
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Correspondence name and address
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OBLON, SPIVAK, MCCLELLAND, MAIER ET AL.
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MARVIN J. SPIVAK
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ATTORNEYS AT LAW, FOURTH FLOOR
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1755 JEFFERSON DAVIS HIGHWAY
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ARLINGTON, VA 22202
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