Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 026217/0840 | |
| Pages: | 4 |
| | Recorded: | 05/04/2011 | | |
| Attorney Dkt #: | P/4076-250 |
| Conveyance: | CORRECTIVE ASSIGNMENT TO CORRECT THE ASSIGNEE'S ADDRESS. THE ASSIGNEE'S ADDRESS SHOULD BE 2 YISHUN AVENUE 7, SINGAPORE, SINGAPORE 768924 PREVIOUSLY RECORDED ON REEL 026075 FRAME 0069. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. |
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Total properties:
1
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Patent #:
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Issue Dt:
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08/05/2014
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Application #:
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13036074
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Filing Dt:
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02/28/2011
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Publication #:
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Pub Dt:
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09/01/2011
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Title:
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APPARATUS FOR MOLDING ELECTRONIC COMPONENTS
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Assignee
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| 2 YISHUN AVENUE 7, |
| SINGAPORE 768924, SINGAPORE |
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Correspondence name and address
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OSTROLENK FABER LLP
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1180 AVENUE OF THE AMERICAS
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NEW YORK, NY 10036
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