Patent Assignment Details
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| Reel/Frame: | 004859/0843 | |
| Pages: | 2 |
| | Recorded: | 03/02/1988 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST. |
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Total properties:
1
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Patent #:
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Issue Dt:
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01/01/1991
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Application #:
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07163338
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Filing Dt:
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03/02/1988
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Title:
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SEMICONDUCTOR DEVICE PACKAGE ASSEMBLY HAVING NON-SYMMETRICAL SEMICONDUCTOR CHIP MOUNTING WITHIN CONDUCTIVE LEAD PATTERN
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Assignee
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| HAGGERTYSTRASSE 1 |
| 8050 FREISING, GERMANY |
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Correspondence name and address
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TEXAS INSTRUMENTS INCORPORATED
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ATTN: GARY HONEYCUTT
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P.O. BOX 655474, M/S 219
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DALLAS, TX 75265
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