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Reel/Frame:034553/0845   Pages: 5
Recorded: 12/19/2014
Attorney Dkt #:21CEN-078PUS
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
01/31/2017
Application #:
14395116
Filing Dt:
10/17/2014
Publication #:
Pub Dt:
03/19/2015
Title:
Integrated Circuit Device Packages And Methods for Manufacturing Integrated Circuit Device Packages
Assignors
1
Exec Dt:
12/02/2014
2
Exec Dt:
12/02/2014
3
Exec Dt:
12/02/2014
4
Exec Dt:
12/02/2014
5
Exec Dt:
12/02/2014
Assignee
1
77, YEONAMYULGEUM-RO
EUMBONG-MYEON
ASAN-SI, CHUNGCHEONGNAM-DO, KOREA, REPUBLIC OF 336-864
Correspondence name and address
DALY, CROWLEY, MOFFORD & DURKEE, LLP
354A TURNPIKE STREET, SUITE 301A
CANTON, MA 02021-2714

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