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Patent Assignment Details
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Reel/Frame:023493/0846   Pages: 2
Recorded: 11/10/2009
Attorney Dkt #:2105.0043C
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
NONE
Issue Dt:
Application #:
12500948
Filing Dt:
07/10/2009
Publication #:
Pub Dt:
04/22/2010
Title:
High Temperature Solder Materials
Assignors
1
Exec Dt:
10/30/2009
2
Exec Dt:
11/05/2009
Assignee
1
0133 COLE STUDENT ACTIVITIES BLDG
OFFICE OF TECHNOLOGY COMMERCIALIZATON
COLLEGE PARK, MARYLAND 20742
Correspondence name and address
JEFFREY I. AUERBACH
1901 RESEARCH BOULEVARD
SUITE 400
ROCKVILLE, MD 20850

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