Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 031997/0846 | |
| Pages: | 6 |
| | Recorded: | 01/13/2014 | | |
| Attorney Dkt #: | 5355/0290PUS1 |
| Conveyance: | CORRECTIVE ASSIGNMENT TO CORRECT THE NAME OF THE SECOND ASSIGNEE FROM MOCROTECH TECHNOLOGY INC. TO MACROTECH TECHNOLOGY INC. PREVIOUSLY RECORDED ON REEL 031043 FRAME 0013. ASSIGNOR(S) HEREBY CONFIRMS THE NAME OF THE SECOND ASSIGNEE. |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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13965993
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Filing Dt:
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08/13/2013
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Publication #:
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Pub Dt:
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02/19/2015
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Title:
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FABRICATION PROCESS AND STRUCTURE TO FORM BUMPS ALIGNED ON TSV ON CHIP BACKSIDE
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Assignees
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| NO. 26, DATONG RD., HSINCHU INDUSTRIAL PARK, HUKOU SHIANG |
| HSINCHU, TAIWAN |
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| NO. 15, LIXING 3RD RD., HSINCHU SCIENCE PARK |
| HSINCHU CITY, TAIWAN |
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Correspondence name and address
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MUNCY, GEISSLER, OLDS & LOWE, P.C.
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4000 LEGATO ROAD
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SUITE 310
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FAIRFAX, VA 22033
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