Patent Assignment Details
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Reel/Frame: | 050905/0849 | |
| Pages: | 3 |
| | Recorded: | 11/04/2019 | | |
Attorney Dkt #: | 2015-0317/24061.3152US02 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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07/13/2021
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Application #:
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16672705
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Filing Dt:
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11/04/2019
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Publication #:
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Pub Dt:
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02/27/2020
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Title:
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Patterning Process of a Semiconductor Structure with a Middle Layer
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Assignee
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NO. 8, LI-HSIN RD. 6 |
SCIENCE-BASED INDUSTRIAL PARK |
HSIN-CHU, TAIWAN 300-77 |
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Correspondence name and address
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HAYNES AND BOONE, LLP IP SECTION
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2323 VICTORY AVENUE
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SUITE 700
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DALLAS, TX 75219
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10/31/2024 07:43 PM
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