Patent Assignment Details
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| Reel/Frame: | 059694/0849 | |
| Pages: | 9 |
| | Recorded: | 04/13/2022 | | |
| Attorney Dkt #: | TSMP20181366US00 |
| Conveyance: | CORRECTIVE ASSIGNMENT TO CORRECT THE FIRST INVENTOR NAME PREVIOUSLY RECORDED AT REEL: 048219 FRAME: 0582. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT . |
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Total properties:
1
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Patent #:
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Issue Dt:
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07/19/2022
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Application #:
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16265136
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Filing Dt:
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02/01/2019
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Publication #:
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Pub Dt:
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04/02/2020
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Title:
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BONDING STRUCTURES IN SEMICONDUCTOR PACKAGED DEVICE AND METHOD OF FORMING SAME
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Assignee
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| 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK |
| HSINCHU, TAIWAN 300-78 |
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Correspondence name and address
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SLATER MATSIL, LLP
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17950 PRESTON RD., SUITE 1000
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DALLAS, TX 75252
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06/04/2024 03:52 AM
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