Patent Assignment Details
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| Reel/Frame: | 013109/0851 | |
| Pages: | 2 |
| | Recorded: | 07/16/2002 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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09/25/2007
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Application #:
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10196305
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Filing Dt:
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07/16/2002
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Publication #:
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Pub Dt:
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12/18/2003
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Title:
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FLIP-CHIP SEMICONDUCTOR PACKAGE WITH LEAD FRAME AS CHIP CARRIER AND FABRICATION METHOD THEREOF
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Assignee
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| NO. 123, SEC. 3, DA FONG RD. |
| TANTZU, TAICHUNG, TAIWAN R.O.C |
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Correspondence name and address
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EDWARDS & ANGELL, LLP
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PETER F. CORLESS
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P.O. BOX 9169
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BOSTON, MASSACHUSETTS 02209
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