|
Total properties:
59
|
|
|
|
Patent #:
|
|
Issue Dt:
|
06/03/1997
|
Application #:
|
08214339
|
Filing Dt:
|
03/16/1994
|
|
Title:
|
MOLD RUNNER REMOVAL FROM A SUBSTRATE-BASED PACKAGED ELECTRONIC DEVICE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
06/24/1997
|
Application #:
|
08479885
|
Filing Dt:
|
06/07/1995
|
|
Title:
|
HEAT SPREADER SUITABLE FOR USE IN SEMICONDUCTOR PACKAGES HAVING DIFFERENT PAD SIZES
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
12/10/1996
|
Application #:
|
08485936
|
Filing Dt:
|
06/07/1995
|
|
Title:
|
COPPER OXIDE-FILLED POLYMER DIE ATTACH ADHESIVE COMPOSITION FOR SEMICONDUCTOR PACKAGE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
03/03/1998
|
Application #:
|
08520429
|
Filing Dt:
|
08/29/1995
|
|
Title:
|
SEMICONDUCTOR LEAD FRAME HAVING CONNECTION BAR AND GUIDE RINGS
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
01/27/1998
|
Application #:
|
08530558
|
Filing Dt:
|
09/19/1995
|
|
Title:
|
METHOD FOR CHECKING A WIRE BOND OF A SEMICONDUCTOR PACKAGE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
05/13/1997
|
Application #:
|
08570794
|
Filing Dt:
|
12/12/1995
|
|
Title:
|
SEMICONDUCTOR PACKAGE WITH INTEGRAL HEAT DISSIPATOR
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
04/21/1998
|
Application #:
|
08570849
|
Filing Dt:
|
12/12/1995
|
|
Title:
|
BONDING METHOD FOR SEMICONDUCTOR CHIPS
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
08/26/1997
|
Application #:
|
08571316
|
Filing Dt:
|
12/12/1995
|
|
Title:
|
CHIP MOUNTING PLATE CONSTRUCTION OF LEAD FRAME FOR SEMICONDUCTOR PACKAGE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
03/17/1998
|
Application #:
|
08588172
|
Filing Dt:
|
01/18/1996
|
|
Title:
|
BALL GRID ARRAY SEMICONDUCTOR PACKAGE WITH IMPROVED HEAT DISSIPATION AND DEHUMIDIFICATION EFFECT
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
06/24/1997
|
Application #:
|
08588482
|
Filing Dt:
|
01/18/1996
|
|
Title:
|
METHOD AND CIRCUIT BOARD STRUCTURE FOR LEVELING SOLDER BALLS IN BALL GRID ARRAY SEMICONDUCTOR PACKAGES
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
12/29/1998
|
Application #:
|
08651200
|
Filing Dt:
|
05/17/1996
|
|
Title:
|
UNIT PRINTED CIRCUIT BOARD CARRIER FRAME FOR BALL GRID ARRAY SEMICONDUCTOR PACKAGES AND METHOD FOR FABRICATING BALL GRID ARRAY SEMICONDUCTOR PACKAGES USING THE SAME
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
11/17/1998
|
Application #:
|
08704477
|
Filing Dt:
|
08/28/1996
|
|
Title:
|
WAFER MAP CONVERSION METHOD
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
09/15/1998
|
Application #:
|
08707381
|
Filing Dt:
|
09/04/1996
|
|
Title:
|
METHOD FOR FABRICATING A HEAT SINK-INTEGRATED SEMICONDUCTOR PACKAGE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
06/10/1997
|
Application #:
|
08729540
|
Filing Dt:
|
10/11/1996
|
|
Title:
|
METHOD FOR MOLDING OF INTEGRATED CIRCUIT PACKAGE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
06/16/1998
|
Application #:
|
08736107
|
Filing Dt:
|
10/24/1996
|
|
Title:
|
PRINTED CIRCUIT BOARD HAVING EPOXY BARRIER AROUND A THROUGHOUT SLOT AND BALL GRID ARRAY SEMICONDUCTOR PACKAGE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
01/13/1998
|
Application #:
|
08748937
|
Filing Dt:
|
11/13/1996
|
|
Title:
|
BALL GRID ARRAY SEMICONDUCTOR PACKAGE WITH RING-TYPE HEAT SINK
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
12/29/1998
|
Application #:
|
08749450
|
Filing Dt:
|
11/15/1996
|
|
Title:
|
SEMICONDUCTOR PACKAGE INCLUDING HEAT SINK WITH LAYERED CONDUCTIVE PLATE AND NON-CONDUCTIVE TAPE BONDING TO LEADS
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
01/12/1999
|
Application #:
|
08749578
|
Filing Dt:
|
11/14/1996
|
|
Title:
|
PROCESS FOR BONDING SEMICONDUCTOR CHIP
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
01/12/1999
|
Application #:
|
08763605
|
Filing Dt:
|
12/11/1996
|
|
Title:
|
SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
05/18/1999
|
Application #:
|
08775212
|
Filing Dt:
|
12/31/1996
|
|
Title:
|
BALL GIRD ARRAY SEMICONDUCTOR PACKAGE USING A METAL CARRIER RING AS A HEAT SPREADER
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
02/02/1999
|
Application #:
|
08775839
|
Filing Dt:
|
12/31/1996
|
|
Title:
|
GRID ARRAY TYPE LEAD FRAME AND LEAD END GRID ARRAY SEMICONDUCTOR PACKAGE EMPLOYING THE SAME
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
06/22/1999
|
Application #:
|
08777927
|
Filing Dt:
|
12/23/1996
|
|
Title:
|
SEMICONDUCTOR CHIP SCALE PACKAGE AND METHOD OF PRODUCING SUCH
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
06/01/1999
|
Application #:
|
08813725
|
Filing Dt:
|
03/07/1997
|
|
Title:
|
METHOD OF FORMING CHIP BUMPS OF BUMP CHIP SCALE SEMICONDUCTOR PACKAGE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
02/16/1999
|
Application #:
|
08825945
|
Filing Dt:
|
04/01/1997
|
|
Title:
|
SOLDER BALL LAND METAL STRUCTURE OF BALL GRID SEMICONDUCTOR PACKAGE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
11/09/1999
|
Application #:
|
08882248
|
Filing Dt:
|
06/25/1997
|
|
Title:
|
PRINTED CIRCUIT BOARD FOR BALL GRID ARRAY SEMICONDUCTOR PACKAGE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
02/08/2000
|
Application #:
|
08882687
|
Filing Dt:
|
06/25/1997
|
|
Title:
|
MARKING BAD PRINTED CIRCUIT BOARDS FOR SEMICONDUCTOR PACKAGES
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
01/26/1999
|
Application #:
|
08883541
|
Filing Dt:
|
06/25/1997
|
|
Title:
|
FLEXIBLE CIRCUIT BOARD FOR BALL GRID ARRAY SEMICONDUCTOR PACKAGE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
09/14/1999
|
Application #:
|
08915077
|
Filing Dt:
|
08/20/1997
|
|
Title:
|
BALL GRID ARRAY SEMICONDUCTOR PACKAGE WITH SOLDER BALLS FUSED ON PRINTED CIRCUIT BOARD AND METHOD FOR FABRICATING THE SAME
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
10/26/1999
|
Application #:
|
08934315
|
Filing Dt:
|
09/19/1997
|
|
Title:
|
MOLD FOR BALL GRID ARRAY SEMICONDUCTOR PACKAGE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
11/16/1999
|
Application #:
|
08942784
|
Filing Dt:
|
10/02/1997
|
|
Title:
|
SEMICONDUCTOR PACKAGE HAVING LIGHT, THIN, SIMPLE AND COMPACT STRUCTURE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
04/27/1999
|
Application #:
|
08951062
|
Filing Dt:
|
10/15/1997
|
|
Title:
|
METHOD FOR REPRODUCING PRINTED CIRCUIT BOARDS FOR SEMICONDUCTOR PACKAGES INCLUDING POOR QUALITY PRINTED CIRCUIT BOARD UNITS AND METHOD FOR FABRICATING SEMICONDUCTOR PACKAGES USING THE REPRODUCED PRINTED CIRCUIT BOARDS
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
04/13/1999
|
Application #:
|
08951890
|
Filing Dt:
|
10/16/1997
|
|
Title:
|
A METHOD FOR MANUFACTURING AN ALUMINA-SILICON CARBIDE NANOCOMPOSITE
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|
|
|
|
Patent #:
|
|
Issue Dt:
|
02/01/2000
|
Application #:
|
09013330
|
Filing Dt:
|
01/26/1998
|
|
Title:
|
METHOD OF MANUFACTURING BALL GRID ARRAY SEMICONDUCTOR PACKAGE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
05/21/2002
|
Application #:
|
09024940
|
Filing Dt:
|
02/17/1998
|
|
Publication #:
|
|
Pub Dt:
|
08/23/2001
| | | | |
|
Title:
|
METHOD OF FABRICATING SEMICONDUCTOR PACKAGE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
04/03/2001
|
Application #:
|
09169438
|
Filing Dt:
|
10/09/1998
|
|
Title:
|
PROGRAMMABLE AND FLEXIBLE POWER MANAGEMENT UNIT
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
08/28/2001
|
Application #:
|
09176614
|
Filing Dt:
|
10/21/1998
|
|
Title:
|
PLASTIC INTEGRATED CIRCUIT DEVICE PACKAGE AND LEADFRAME
HAVING PARTIALLY UNDERCUT LEADS AND DIE PAD
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
11/21/2000
|
Application #:
|
09203720
|
Filing Dt:
|
12/01/1998
|
|
Title:
|
GRID ARRAY TYPE LEAD FRAME HAVING LEAD ENDS IN DIFFERENT PLANES
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
07/18/2000
|
Application #:
|
09222226
|
Filing Dt:
|
12/29/1998
|
|
Title:
|
BUMP CHIP SCALE SEMICONDUCTOR PACKAGE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
06/12/2001
|
Application #:
|
09240422
|
Filing Dt:
|
01/29/1999
|
|
Title:
|
"PRINTED CIRCUIT BOARD FOR BALL GRID ARRAY SEMICONDUCTOR PACKAGES"
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
10/16/2001
|
Application #:
|
09287711
|
Filing Dt:
|
04/07/1999
|
|
Title:
|
THIN, STACKABLE SEMICONDUCTOR PACKAGES
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
07/31/2001
|
Application #:
|
09305170
|
Filing Dt:
|
05/04/1999
|
|
Title:
|
PRINTED CIRCUIT BOARD WITH OVAL SOLDER BALL LANDS FOR BGA SEMICONDUCTOR PACKAGES
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
07/10/2001
|
Application #:
|
09370600
|
Filing Dt:
|
08/09/1999
|
|
Title:
|
METHOD OF MAKING AN ELECTRONIC DEVICE PACKAGE AND LEADFRAME
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
07/08/2003
|
Application #:
|
09385694
|
Filing Dt:
|
08/30/1999
|
|
Title:
|
WAFER-SCALE PRODUCTION OF CHIP-SCALE SEMICONDUCTOR PACKAGES USING WAFER MAPPING TECHNIQUES
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
08/06/2002
|
Application #:
|
09385695
|
Filing Dt:
|
08/30/1999
|
|
Title:
|
METHOD FOR LAMINATING CIRCUIT PATTERN TAPE ON SEMICONDUCTOR WAFER
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
11/12/2002
|
Application #:
|
09387377
|
Filing Dt:
|
08/30/1999
|
|
Title:
|
CIRCUIT PATTERN TAPE FOR WAFER-SCALE PRODUCTION OF CHIP SIZE SEMICONDUCTOR PACKAGES
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
08/20/2002
|
Application #:
|
09391792
|
Filing Dt:
|
09/08/1999
|
|
Title:
|
LEAD FRAME USED FOR THE FABRICATION OF SEMICONDUCTOR PACKAGES AND SEMICONDUCTOR PACKAGE FABRICATED USING THE SAME
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
09/24/2002
|
Application #:
|
09395875
|
Filing Dt:
|
09/14/1999
|
|
Title:
|
METHOD FOR MOLDING A LEADFRAME IN PLASTIC INTEGRATED CIRCUIT DEVICES
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
10/08/2002
|
Application #:
|
09422027
|
Filing Dt:
|
10/20/1999
|
|
Title:
|
CHIP-SCALE SEMICONDUCTOR PACKAGE OF THE FAN-OUT TYPE AND METHOD OF MANUFACTURING SUCH PACKAGES
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
12/03/2002
|
Application #:
|
09422115
|
Filing Dt:
|
10/20/1999
|
|
Title:
|
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SUCH DEVICE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
09/10/2002
|
Application #:
|
09444035
|
Filing Dt:
|
11/19/1999
|
|
Title:
|
SEMICONDUCTOR PACKAGE AND METHOD OF MAKING USING LEADFRAME HAVING LEAD LOCKS TO SECURE LEADS TO ENCAPSULANT
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
04/09/2002
|
Application #:
|
09461523
|
Filing Dt:
|
12/14/1999
|
|
Title:
|
SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
07/02/2002
|
Application #:
|
09490317
|
Filing Dt:
|
01/24/2000
|
|
Title:
|
PACKAGE FOR STACKED INTEGRATED CIRCUITS
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
03/07/2006
|
Application #:
|
09513067
|
Filing Dt:
|
02/24/2000
|
|
Title:
|
NONEXPOSED HEAT SINK FOR SEMICONDUCTOR PACKAGE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
07/23/2002
|
Application #:
|
09513232
|
Filing Dt:
|
02/24/2000
|
|
Title:
|
LEADFRAME FOR MOLDED SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE MADE USING THE LEADFRAME
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
05/28/2002
|
Application #:
|
09574541
|
Filing Dt:
|
05/19/2000
|
|
Title:
|
Semiconductor package and method for fabricating the same
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
01/28/2003
|
Application #:
|
09589713
|
Filing Dt:
|
06/07/2000
|
|
Title:
|
CIRCUIT BOARD SEMICONDUCTOR PACKAGE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
09/28/2004
|
Application #:
|
09648284
|
Filing Dt:
|
08/24/2000
|
|
Title:
|
SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
10/22/2002
|
Application #:
|
09648946
|
Filing Dt:
|
08/23/2000
|
|
Title:
|
CIRCUIT BOARD FOR SEMICONDUCTOR PACKAGE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
07/13/2004
|
Application #:
|
09774952
|
Filing Dt:
|
01/30/2001
|
|
Publication #:
|
|
Pub Dt:
|
06/28/2001
| | | | |
|
Title:
|
SEMICONDUCTOR PACKAGE HAVING SEMICONDUCTOR CHIP WITHIN CENTRAL APERTURE OF SUBSTRATE
|
|
