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Patent Assignment Details
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Reel/Frame:025632/0853   Pages: 3
Recorded: 12/24/2010
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
10/23/2012
Application #:
12928986
Filing Dt:
12/24/2010
Publication #:
Pub Dt:
10/20/2011
Title:
CHIP PACKAGE STRUCTURE AND METHOD OF MAKING THE SAME
Assignors
1
Exec Dt:
12/21/2010
2
Exec Dt:
12/21/2010
Assignee
1
A1501 TECHNOLOGY MANSION
EAST SOFTWARE PARK, NO. 90 WENSAN ROAD
HANGZHOU, ZHEJIANG PROVINCE, CHINA 310012
Correspondence name and address
MICHAEL C. STEPHENS, JR
22779 MONTROSE COURT
LOS GATOS, CALIFORNIA 95033

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