Total properties:
31
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Patent #:
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Issue Dt:
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05/05/1981
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Application #:
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05950266
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Filing Dt:
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10/10/1978
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Title:
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LAYER-BUILT LAMINATED BUS EMBEDDING CONDENSERS
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Patent #:
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Issue Dt:
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11/25/1980
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Application #:
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06001139
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Filing Dt:
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01/05/1979
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Title:
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SIGNAL CANCELLING DEVICE
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Patent #:
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Issue Dt:
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11/25/1980
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Application #:
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06059068
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Filing Dt:
|
07/19/1979
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Title:
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HIGH CAPACITANCE MULTILAYER BUS BAR AND METHOD OF MANUFACTURE THEREOF
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Patent #:
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Issue Dt:
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08/03/1982
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Application #:
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06154375
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Filing Dt:
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05/29/1980
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Title:
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LAMINATED BUS BAR AND METHOD OF MANUFACTURE
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Patent #:
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Issue Dt:
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12/13/1983
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Application #:
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06154376
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Filing Dt:
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05/29/1980
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Title:
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HIGH CAPACITANCE BUS BAR AND METHOD OF MANUFACTURE THEREOF
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Patent #:
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Issue Dt:
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10/02/1984
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Application #:
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06456654
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Filing Dt:
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01/10/1983
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Title:
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DECOUPLING CAPACITOR AND METHOD OF MANUFACTURE THEREOF
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Patent #:
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Issue Dt:
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01/13/1987
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Application #:
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06683344
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Filing Dt:
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12/19/1984
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Title:
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DECOUPLED INTEGRATED CIRCUIT PACKAGE
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Patent #:
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Issue Dt:
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04/22/1986
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Application #:
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06690117
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Filing Dt:
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01/09/1985
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Title:
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FLAT DECOUPLING CAPACITOR AND METHOD OF MANUFACTURE THEREOF
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Patent #:
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Issue Dt:
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12/16/1986
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Application #:
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06711393
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Filing Dt:
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03/13/1985
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Title:
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DECOUPLING CAPACITOR AND METHOD OF MANUFACTURE THEREOF
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Patent #:
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Issue Dt:
|
11/11/1986
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Application #:
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06711478
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Filing Dt:
|
03/13/1985
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Title:
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DECOUPLING CAPACITOR AND METHOD OF MANUFACTURE THEREOF
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Patent #:
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|
Issue Dt:
|
04/14/1987
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Application #:
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06763826
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Filing Dt:
|
08/08/1985
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Title:
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DECOUPLING CAPACITOR FOR SURFACE MOUNTED CHIP CARRIER
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Patent #:
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|
Issue Dt:
|
07/08/1986
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Application #:
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06773431
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Filing Dt:
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09/06/1985
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Title:
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HIGH CAPACITANCE BUS BAR INCLUDING MULTILAYER CERAMIC CAPACITORS
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Patent #:
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Issue Dt:
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12/02/1986
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Application #:
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06811673
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Filing Dt:
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12/20/1985
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Title:
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DECOUPLING CAPACITOR FOR PIN GRID ARRAY PACKAGE
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Patent #:
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Issue Dt:
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03/29/1988
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Application #:
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07027739
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Filing Dt:
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03/19/1987
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Title:
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DECOUPLING CAPACITOR FOR SURFACE MOUNTED LEADLESS CHIP CARRIER, SURFACE MOUNTED LEADED CHIP CARRIER AND PIN GRID ARRAY PACKAGE
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Patent #:
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Issue Dt:
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06/28/1988
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Application #:
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07027932
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Filing Dt:
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03/19/1987
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Title:
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DECOUPLING CAPACITOR FOR LEADLESS SURFACE MOUNTED CHIP CARRIER
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Patent #:
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Issue Dt:
|
03/29/1988
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Application #:
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07028172
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Filing Dt:
|
03/19/1987
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Title:
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DECOUPLING CAPACITOR FOR SURFACE MOUNTED LEADLESS CHIP CARRIERS, SURFACE MOUNTED LEADED CHIP CARRIERS AND PIN GRID ARRAY PACKAGES
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|
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Patent #:
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Issue Dt:
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05/31/1988
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Application #:
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07094441
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Filing Dt:
|
09/08/1987
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Title:
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DECOUPLING CAPACITOR AND METHOD OF FORMATION THEREOF
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|
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Patent #:
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|
Issue Dt:
|
10/10/1989
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Application #:
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07226601
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Filing Dt:
|
08/01/1988
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Title:
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TEMPERATURE STABLE MULTILAYER CAPACITOR
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|
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Patent #:
|
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Issue Dt:
|
08/01/1989
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Application #:
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07226602
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Filing Dt:
|
08/01/1988
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Title:
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LOW INDUCTANCE DECOUPLING CAPACITOR
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|
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Patent #:
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|
Issue Dt:
|
03/13/1990
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Application #:
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07226619
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Filing Dt:
|
08/01/1988
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Title:
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HIGH DIELECTRIC CONSTANT FLEXIBLE SHEET MATERIAL
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|
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Patent #:
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|
Issue Dt:
|
09/24/1991
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Application #:
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07291514
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Filing Dt:
|
12/29/1988
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Title:
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LOW IMPEDANCE BUS BAR
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|
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Patent #:
|
|
Issue Dt:
|
08/01/1989
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Application #:
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07291520
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Filing Dt:
|
12/29/1988
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Title:
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HIGH DIELECTRIC MULTILAYER CAPACITOR
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Patent #:
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|
Issue Dt:
|
11/12/1991
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Application #:
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07291531
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Filing Dt:
|
12/29/1988
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Title:
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MULTILAYER PRINTED WIRING BOARD
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|
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Patent #:
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|
Issue Dt:
|
01/29/1991
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Application #:
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07479071
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Filing Dt:
|
02/12/1990
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Title:
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MOLDED INTEGRATED CIRCUIT PACKAGE INCORPORATING THIN DECOUPLING CAPACITOR
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Patent #:
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|
Issue Dt:
|
11/12/1991
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Application #:
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07479073
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Filing Dt:
|
02/12/1990
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Title:
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MOLDED INTEGRATED CIRCUIT PACKAGE INCORPORATING HEAT SINK
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|
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Patent #:
|
|
Issue Dt:
|
12/21/1993
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Application #:
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07479074
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Filing Dt:
|
02/12/1990
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Title:
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INTEGRATED CIRCUIT PACKAGE HAVING AN INTERNAL CAVITY FOR INCORPORATING DECOUPLING CAPACITOR
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|
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Patent #:
|
|
Issue Dt:
|
02/19/1991
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Application #:
|
07479075
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Filing Dt:
|
02/12/1990
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Title:
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MOLDED INTEGRATED CIRCUIT PACKAGE INCORPORATING DECOUPLING CAPACITOR
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|
|
Patent #:
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|
Issue Dt:
|
07/23/1991
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Application #:
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07479095
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Filing Dt:
|
02/12/1990
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Title:
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THIN DECOUPLING CAPACITOR FOR MOUNTING UNDER INTEGRATED CIRCUIT PACKAGE
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|
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Patent #:
|
|
Issue Dt:
|
03/10/1992
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Application #:
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07591778
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Filing Dt:
|
10/02/1990
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Title:
|
INTERNALLY DECOUPLED INTEGRATED CIRCUIT PACKAGE
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|
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Patent #:
|
|
Issue Dt:
|
02/09/1993
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Application #:
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07778683
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Filing Dt:
|
10/16/1991
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Title:
|
HIGH DIELECTRIC CONSTANT SHEET MATERIAL
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|
|
Patent #:
|
|
Issue Dt:
|
|
Application #:
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UNAVAILABLE
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Filing Dt:
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Title:
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