Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 017923/0855 | |
| Pages: | 3 |
| | Recorded: | 05/25/2006 | | |
| Attorney Dkt #: | 040323-00180US |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11356273
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Filing Dt:
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02/15/2006
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Publication #:
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Pub Dt:
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09/14/2006
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Title:
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Method and apparatus for dielectric bonding of silicon wafer flow fields
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Assignee
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| 7205 NW EVERGREEN PARKWAY |
| SUITE 100 |
| HILLSBORO, OREGON 97124 |
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Correspondence name and address
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WILLIAM F. VOBACH
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TOWNSEND AND TOWNSEDN AND CREW LLP
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TWO EMBARCADERO CENTER
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EIGHTH FLOOR
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SAN FRANCISCO, CALIFORNIA 94111-3834
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