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Reel/Frame:035303/0855   Pages: 4
Recorded: 03/31/2015
Attorney Dkt #:13-LNG-0567US01 (52223)
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
06/14/2016
Application #:
14587324
Filing Dt:
12/31/2014
Publication #:
Pub Dt:
07/02/2015
Title:
COMPACT ELECTRONIC PACKAGE WITH MEMS IC AND RELATED METHODS
Assignor
1
Exec Dt:
03/31/2015
Assignee
1
4F&B501-B503 & 6F & B701-B702, BLOCK B, TCL R&D TOWER, NO. 6
SOUTHERN NO. 1 ROAD, SOUTH DISTRICT, HI-TECH INDUSTRIAL PARK
NANSHAN, SHENZHEN, CHINA 518057
Correspondence name and address
CHRISTOPHER F. REGAN
255 S. ORANGE AVE.
STE. 1401
ORLANDO, FL 32801

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