Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
| Reel/Frame: | 023995/0856 | |
| Pages: | 4 |
| | Recorded: | 02/26/2010 | | |
| Attorney Dkt #: | 250347-1021 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
|
|
Total properties:
1
|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
12713333
|
Filing Dt:
|
02/26/2010
|
|
Publication #:
|
|
Pub Dt:
|
06/24/2010
| | | | |
|
Title:
|
Chip-Stacked Package Structure
|
|
|
Assignee
|
|
|
|
|
| NO. 1, R&D. 1, SCIENCE-BASED INDUSTRIAL PARK |
| HSINCHU, TAIWAN |
|
|
Correspondence name and address
|
| |
THOMAS, KAYDEN, HORSTEMEYER & RISLEY, LL
|
| |
600 GALLERIA PARKWAY, S.E.
|
| |
STE 1500
|
| |
ATLANTA, GA 30339-5994
|
Search Results as of:
05/31/2024 04:48 AM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
