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Reel/Frame:030701/0856   Pages: 4
Recorded: 06/27/2013
Attorney Dkt #:US46528
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
NONE
Issue Dt:
Application #:
13928721
Filing Dt:
06/27/2013
Publication #:
Pub Dt:
02/27/2014
Title:
CHIP PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING SAME
Assignor
1
Exec Dt:
06/27/2013
Assignees
1
NO.18,TENGFEI ROAD,ECONOMIC AND TECHNOLOGICAL DEVELOPMENT ZONE
QINHUANGDAO, CHINA
2
NO. 6, LANE 28, SAN HO RD., SAN SHI VILLAGE
TAYUAN, TAOYUAN, TAIWAN
Correspondence name and address
CLIFFORD O. CHI
1203 W. IMPERIAL HWY SUITE 100
BREA, CA 92821

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