Patent Assignment Details
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Reel/Frame: | 004182/0857 | |
| Pages: | 1 |
| | Recorded: | 09/29/1983 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST. |
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Total properties:
1
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Patent #:
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Issue Dt:
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08/14/1984
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Application #:
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06537059
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Filing Dt:
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09/29/1983
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Title:
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METHOD OF BONDING A POLY (VINYLIDENE FLUORIDE) SOLID TO A SOILD SUBSTRATE
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Correspondence name and address
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RICHARD V. LANG
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ELECTRONIC SYSTEMS DIVISION
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GENERAL ELECTRIC CO.
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ELECTRONICS PARK 2-205
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SYRACUSE, NY 13221
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