Patent Assignment Details
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Reel/Frame: | 036742/0858 | |
| Pages: | 40 |
| | Recorded: | 10/02/2015 | | |
Conveyance: | CHANGE OF NAME & ADDRESS |
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Total properties:
1
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Patent #:
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Issue Dt:
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03/08/2011
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Application #:
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11547323
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Filing Dt:
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10/02/2006
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Publication #:
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Pub Dt:
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08/30/2007
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Title:
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METHOD OF MANUFACTURING SEALED ELECTRONIC COMPONENT AND SEALED ELECTRONIC COMPONENT
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Assignee
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6663-2, FUNATSU, FUJIKAWAGUCHIKO-MACHI, MINAMITSURU-GUN |
YAMANASHI, JAPAN 401-0395 |
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Correspondence name and address
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CPA GLOBAL LTD
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LIBERATION HOUSE
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CASTLE STREET
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ST HELIER, JE1 1BL JERSEY
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