Patent Assignment Details
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| Reel/Frame: | 016321/0859 | |
| Pages: | 4 |
| | Recorded: | 07/28/2005 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11180494
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Filing Dt:
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07/13/2005
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Publication #:
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Pub Dt:
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02/02/2006
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Title:
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Chip-under-tape package structure and manufacture thereof
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Assignees
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| NO. 1, YANFA 1ST RD. |
| HSINCHU CITY, TAIWAN 300 |
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| CANON'S COURT |
| 22 VICTORIA STREET |
| HAMILTON, BERMUDA HM12 |
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Correspondence name and address
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HOFFMAN, WARNICK & D'ALESSANDRO LLC
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75 STATE STREET, 14TH FLOOR
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ALBANY, NY 12207
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