Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
| Reel/Frame: | 052064/0859 | |
| Pages: | 3 |
| | Recorded: | 03/02/2020 | | |
| Attorney Dkt #: | 01.AC2876-US |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
|
|
Total properties:
1
|
|
|
|
Patent #:
|
|
Issue Dt:
|
09/05/2023
|
Application #:
|
16805392
|
Filing Dt:
|
02/28/2020
|
|
Publication #:
|
|
Pub Dt:
|
09/02/2021
| | | | |
|
Title:
|
HIGH THERMAL CONDUCTIVITY, HIGH MODULUS STRUCTURE WITHIN A MOLD MATERIAL LAYER OF AN INTEGRATED CIRCUIT PACKAGE
|
|
|
Assignee
|
|
|
|
|
| 2200 MISSION COLLEGE BLVD. |
| SANTA CLARA, CALIFORNIA 95054 |
|
|
Correspondence name and address
|
| |
GREEN, HOWARD, & MUGHAL LLP.
|
| |
5 CENTERPOINTE DRIVE
|
| |
SUITE 400
|
| |
LAKE OSWEGO, OR 97035
|
Search Results as of:
05/27/2024 08:20 PM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
