Patent Assignment Details
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| Reel/Frame: | 043636/0862 | |
| Pages: | 5 |
| | Recorded: | 08/22/2017 | | |
| Attorney Dkt #: | 28913US02 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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08/28/2018
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Application #:
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15683328
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Filing Dt:
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08/22/2017
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Publication #:
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Pub Dt:
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03/22/2018
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Title:
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Encapsulated Semiconductor Package and Method of Manufacturing Thereof
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Assignee
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| 2045 E. INNOVATION CIRCLE |
| TEMPE, ARIZONA 85284 |
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Correspondence name and address
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MCANDREWS, HELD & MALLOY, LTD.
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500 WEST MADISON ST., FLOOR 34
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CHICAGO, IL 60661
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