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Reel/Frame:030761/0863   Pages: 3
Recorded: 07/09/2013
Attorney Dkt #:093036B2B1B1D3C1D1C9
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
NONE
Issue Dt:
Application #:
11877654
Filing Dt:
10/23/2007
Publication #:
Pub Dt:
02/21/2008
Title:
HIGH PERFORMANCE SYSTEM-ON-CHIP USING POST PASSIVATION PROCESS
Assignor
1
Exec Dt:
10/14/2004
Assignee
1
21, R&D FIRST ROAD
SCIENCE-BASED INDUSTRIAL PARK
HSIN-CHU, TAIWAN
Correspondence name and address
QUALCOMM INCORPORATED
5775 MOREHOUSE DRIVE
SAN DIEGO, CA 92121-1714

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