Patent Assignment Details
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Reel/Frame: | 037042/0863 | |
| Pages: | 3 |
| | Recorded: | 11/16/2015 | | |
Attorney Dkt #: | TWT04180/US |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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11/06/2018
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Application #:
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14941665
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Filing Dt:
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11/16/2015
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Publication #:
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Pub Dt:
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05/18/2017
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Title:
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METHODS OF FABRICATING A SEMICONDUCTOR STRUCTURE
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Assignee
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NO.667, FUHSING 3RD RD., HWA-YA TECHNOLOGY PARK, GUISHAN DIST. |
TAOYUAN CITY, TAIWAN 333 |
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Correspondence name and address
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CKC & PARTNERS CO., LTD.
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12TH FLOOR, RUTTONJEE HOUSE
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11 DUDDELL STREET
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HONG KONG, HONG KONG
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05/30/2024 02:13 AM
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