Patent Assignment Details
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| Reel/Frame: | 064182/0863 | |
| Pages: | 5 |
| | Recorded: | 07/07/2023 | | |
| Attorney Dkt #: | 140196.526C1 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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08/29/2023
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Application #:
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17484938
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Filing Dt:
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09/24/2021
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Publication #:
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Pub Dt:
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01/13/2022
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Title:
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METHOD AND APPARATUS FOR DEBUGGING A DEVICE
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Assignee
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| 2/F BAIDU CAMPUS, NO. 10 |
| SHANGDI 10TH STREET, HAIDIAN DISTRICT |
| BEIJING, CHINA 100085 |
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Correspondence name and address
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SEED IP LAW GROUP LLP
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701 FIFTH AVENUE
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SUITE 5400
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SEATTLE, WA 98104
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