Patent Assignment Details
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| Reel/Frame: | 018136/0865 | |
| Pages: | 3 |
| | Recorded: | 08/03/2006 | | |
| Attorney Dkt #: | CU-4860 WWP |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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10/21/2008
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Application #:
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11498517
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Filing Dt:
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08/03/2006
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Publication #:
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Pub Dt:
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02/15/2007
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Title:
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METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE FOR IMPROVING CONTACT HOLE FILLING CHARACTERISTICS WHILE REDUCING PARASITIC CAPACITANCE OF INTER-METAL DIELECTRIC
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Assignee
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| SAN 136-1, AMI-RI, |
| BUBAL-EUB, ICHEON-SI, KYOUNGKI-DO,, KOREA, REPUBLIC OF |
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Correspondence name and address
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RICHARD J. STREIT
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C/O LADAS & PARRY
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224 SOUTH MICHIGAN AVENUE
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CHICAGO, ILLINOIS 60604
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