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NOTE:Results display only for issued patents and published applications. For pending or abandoned applications please consult USPTO staff.

Reel/Frame:	017388/0868			Pages:	25
		Recorded:	01/03/2006
Conveyance:	TERMINATION & RELEASE OF PATENT SECURITY AGREEMENT

Total properties: 293
Page 3 of 3
Pages: 1 2 3

Patent #:	6444449	Issue Dt:	09/03/2002	Application #:	09634496	Filing Dt:	08/08/2000
Title:	D-SORBITOL DEHYDROGENASE GENE

Patent #:	6469258	Issue Dt:	10/22/2002	Application #:	09648946	Filing Dt:	08/23/2000
Title:	CIRCUIT BOARD FOR SEMICONDUCTOR PACKAGE

Patent #:	6406934	Issue Dt:	06/18/2002	Application #:	09654978	Filing Dt:	09/05/2000
Title:	WAFER LEVEL PRODUCTION OF CHIP SIZE SEMICONDUCTOR PACKAGES

Patent #:	6577013	Issue Dt:	06/10/2003	Application #:	09655439	Filing Dt:	09/05/2000
Title:	CHIP SIZE SEMICONDUCTOR PACKAGES WITH STACKED DIES

Patent #:	6624005	Issue Dt:	09/23/2003	Application #:	09656253	Filing Dt:	09/06/2000
Title:	SEMICONDUCTOR MEMORY CARDS AND METHOD OF MAKING SAME

Patent #:	6552416	Issue Dt:	04/22/2003	Application #:	09659017	Filing Dt:	09/08/2000
Title:	MULTIPLE DIE LEAD FRAME PACKAGE WITH ENHANCED DIE-TO DIE INTERCONNECT ROUTING USING INTERNAL LEAD TRACE WIRING

Patent #:	6522015	Issue Dt:	02/18/2003	Application #:	09670499	Filing Dt:	09/26/2000
Title:	MICROMACHINE STACKED WIREBONDED PACKAGE

Patent #:	6638789	Issue Dt:	10/28/2003	Application #:	09670500	Filing Dt:	09/26/2000
Title:	MICROMACHINE STACKED WIREBONDED PACKAGE FABRICATION METHOD

Patent #:	6530515	Issue Dt:	03/11/2003	Application #:	09670501	Filing Dt:	09/26/2000
Title:	MICROMACHINE STACKED FLIP CHIP PACKAGE FABRICATION METHOD

Patent #:	6525406	Issue Dt:	02/25/2003	Application #:	09687049	Filing Dt:	10/13/2000
Title:	SEMICONDUCTOR DEVICE HAVING INCREASED MOISTURE PATH AND INCREASED SOLDER JOINT STRENGTH

Patent #:	6616436	Issue Dt:	09/09/2003	Application #:	09687126	Filing Dt:	10/13/2000
Title:	APPARATUS FOR MANUFACTURING SEMICONDUCTOR PACKAGES

Patent #:	6627976	Issue Dt:	09/30/2003	Application #:	09687331	Filing Dt:	10/13/2000
Title:	LEADFRAME FOR SEMICONDUCTOR PACKAGE AND MOLD FOR MOLDING THE SAME

Patent #:	6501161	Issue Dt:	12/31/2002	Application #:	09687485	Filing Dt:	10/13/2000
Title:	SEMICONDUCTOR PACKAGE HAVING INCREASED SOLDER JOINT STRENGTH

Patent #:	6605866	Issue Dt:	08/12/2003	Application #:	09687531	Filing Dt:	10/13/2000
Title:	STACKABLE SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING SAME

Patent #:	6475827	Issue Dt:	11/05/2002	Application #:	09687532	Filing Dt:	10/13/2000
Title:	METHOD FOR MAKING A SEMICONDUCTOR PACKAGE HAVING IMPROVED DEFECT TESTING AND INCREASED PRODUCTION YIELD

Patent #:	6555899	Issue Dt:	04/29/2003	Application #:	09687541	Filing Dt:	10/13/2000
Title:	SEMICONDUCTOR PACKAGE LEADFRAME ASSEMBLY AND METHOD OF MANUFACTURE

Patent #:	6646339	Issue Dt:	11/11/2003	Application #:	09687787	Filing Dt:	10/13/2000
Title:	THIN AND HEAT RADIANT SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING

Patent #:	6639308	Issue Dt:	10/28/2003	Application #:	09687876	Filing Dt:	10/13/2000
Title:	NEAR CHIP SIZE SEMICONDUCTOR PACKAGE

Patent #:	6340623	Issue Dt:	01/22/2002	Application #:	09693466	Filing Dt:	10/20/2000
Title:	Method of fabricating semiconductor device

Patent #:	6521987	Issue Dt:	02/18/2003	Application #:	09703195	Filing Dt:	10/31/2000
Title:	PLASTIC INTEGRATED CIRCUIT DEVICE PACKAGE AND METHOD FOR MAKING THE PACKAGE

Patent #:	6509560	Issue Dt:	01/21/2003	Application #:	09711993	Filing Dt:	11/13/2000
Title:	CHIP SIZE IMAGE SENSOR IN WIREBOND PACKAGE WITH STEP-UP RING FOR ELECTRICAL CONTACT

Patent #:	6629633	Issue Dt:	10/07/2003	Application #:	09711994	Filing Dt:	11/13/2000
Title:	CHIP SIZE IMAGE SENSOR BUMPER PACKAGE FABRICATION METHOD

Patent #:	6528857	Issue Dt:	03/04/2003	Application #:	09712313	Filing Dt:	11/13/2000
Title:	CHIP SIZE IMAGE SENSOR BUMPED PACKAGE

Patent #:	6620646	Issue Dt:	09/16/2003	Application #:	09712314	Filing Dt:	11/13/2000
Title:	CHIP SIZE IMAGE SENSOR WIREBOND PACKAGE FABRICATION METHOD

Patent #:	6532157	Issue Dt:	03/11/2003	Application #:	09714622	Filing Dt:	11/16/2000
Title:	ANGULATED SEMICONDUCTOR PACKAGES

Patent #:	6342406	Issue Dt:	01/29/2002	Application #:	09714682	Filing Dt:	11/15/2000
Title:	Flip chip on glass image sensor package fabrication method

Patent #:	6340846	Issue Dt:	01/22/2002	Application #:	09730721	Filing Dt:	12/06/2000
Title:	Making semiconductor packages with stacked dies and reinforced wire bonds

Patent #:	6566164	Issue Dt:	05/20/2003	Application #:	09733148	Filing Dt:	12/07/2000
Title:	EXPOSED COPPER STRAP IN A SEMICONDUCTOR PACKAGE

Patent #:	6642610	Issue Dt:	11/04/2003	Application #:	09745265	Filing Dt:	12/20/2000
Publication #:	US20020064905	Pub Dt:	05/30/2002
Title:	WIRE BONDING METHOD AND SEMICONDUCTOR PACKAGE MANUFACTURED USING THE SAME

Patent #:	6564454	Issue Dt:	05/20/2003	Application #:	09752244	Filing Dt:	12/28/2000
Title:	METHOD OF MAKING AND STACKING A SEMICONDUCTOR PACKAGE

Patent #:	6448506	Issue Dt:	09/10/2002	Application #:	09752662	Filing Dt:	12/28/2000
Title:	SEMICONDUCTOR PACKAGE AND CIRCUIT BOARD FOR MAKING THE PACKAGE

Patent #:	6420201	Issue Dt:	07/16/2002	Application #:	09754229	Filing Dt:	01/03/2001
Title:	METHOD FOR FORMING A BOND WIRE PRESSURE SENSOR DIE PACKAGE

Patent #:	6432737	Issue Dt:	08/13/2002	Application #:	09754239	Filing Dt:	01/03/2001
Title:	METHOD FOR FORMING A FLIP CHIP PRESSURE SENSOR DIE PACKAGE

Patent #:	6441503	Issue Dt:	08/27/2002	Application #:	09754393	Filing Dt:	01/03/2001
Title:	BOND WIRE PRESSURE SENSOR DIE PACKAGE

Patent #:	6610167	Issue Dt:	08/26/2003	Application #:	09764166	Filing Dt:	01/16/2001
Title:	METHOD FOR FABRICATING A SPECIAL-PURPOSE DIE USING A POLYMERIZABLE TAPE

Patent #:	6572944	Issue Dt:	06/03/2003	Application #:	09764190	Filing Dt:	01/16/2001
Title:	STRUCTURE FOR FABRICATING A SPECIAL-PURPOSE DIE USING A POLYMERIZABLE TAPE

Patent #:	6445075	Issue Dt:	09/03/2002	Application #:	09770859	Filing Dt:	01/26/2001
Title:	SEMICONDUCTOR MODULE PACKAGE SUBSTRATE

Patent #:	6494361	Issue Dt:	12/17/2002	Application #:	09770861	Filing Dt:	01/26/2001
Title:	SEMICONDUCTOR MODULE PACKAGE SUBSTRATE FABRICATION METHOD

Patent #:	6476331	Issue Dt:	11/05/2002	Application #:	09783797	Filing Dt:	02/14/2001
Title:	PRINTED CIRCUIT BOARD FOR SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

Patent #:	6399463	Issue Dt:	06/04/2002	Application #:	09797756	Filing Dt:	03/01/2001
Title:	METHOD OF SINGULATION USING LASER CUTTING

Patent #:	6420776	Issue Dt:	07/16/2002	Application #:	09797759	Filing Dt:	03/01/2001
Title:	STRUCTURE INCLUDING ELECTRONIC COMPONENTS SINGULATED USING LASER CUTTING

Patent #:	6455927	Issue Dt:	09/24/2002	Application #:	09804749	Filing Dt:	03/12/2001
Title:	MICROMIRROR DEVICE PACKAGE

Patent #:	6624921	Issue Dt:	09/23/2003	Application #:	09804805	Filing Dt:	03/12/2001
Title:	MICROMIRROR DEVICE PACKAGE FABRICATION METHOD

Patent #:	6580153	Issue Dt:	06/17/2003	Application #:	09811183	Filing Dt:	03/14/2001
Title:	STRUCTURE FOR PROTECTING A MICROMACHINE WITH A CAVITY IN A UV TAPE

Patent #:	6486537	Issue Dt:	11/26/2002	Application #:	09812426	Filing Dt:	03/19/2001
Title:	SEMICONDUCTOR PACKAGE WITH WARPAGE RESISTANT SUBSTRATE

Patent #:	6545345	Issue Dt:	04/08/2003	Application #:	09813485	Filing Dt:	03/20/2001
Title:	MOUNTING FOR A PACKAGE CONTAINING A CHIP

Patent #:	6597059	Issue Dt:	07/22/2003	Application #:	09825785	Filing Dt:	04/04/2001
Title:	THERMALLY ENHANCED CHIP SCALE LEAD ON CHIP SEMICONDUCTOR PACKAGE

Patent #:	6528869	Issue Dt:	03/04/2003	Application #:	09827619	Filing Dt:	04/06/2001
Title:	SEMICONDUCTOR PACKAGE WITH MOLDED SUBSTRATE AND RECESSED INPUT/OUTPUT TERMINALS

Patent #:	6603072	Issue Dt:	08/05/2003	Application #:	09828046	Filing Dt:	04/06/2001
Title:	MAKING LEADFRAME SEMICONDUCTOR PACKAGES WITH STACKED DIES AND INTERCONNECTING INTERPOSER

Patent #:	6437449	Issue Dt:	08/20/2002	Application #:	09828396	Filing Dt:	04/06/2001
Title:	MAKING SEMICONDUCTOR DEVICES HAVING STACKED DIES WITH BIASED BACK SURFACES

Patent #:	6580167	Issue Dt:	06/17/2003	Application #:	09839284	Filing Dt:	04/20/2001
Title:	HEAT SPREADER WITH SPRING IC PACKAGE

Patent #:	6562655	Issue Dt:	05/13/2003	Application #:	09839288	Filing Dt:	04/20/2001
Title:	HEAT SPREADER WITH SPRING IC PACKAGE FABRICATION METHOD

Patent #:	6528875	Issue Dt:	03/04/2003	Application #:	09839305	Filing Dt:	04/20/2001
Title:	VACUUM SEALED PACKAGE FOR SEMICONDUCTOR CHIP

Patent #:	6420204	Issue Dt:	07/16/2002	Application #:	09839861	Filing Dt:	04/20/2001
Publication #:	US20010014486	Pub Dt:	08/16/2001
Title:	METHOD OF MAKING A PLASTIC PAKAGE FOR AN OPTICAL INTEGRATED CIRCUIT DEVICE

Patent #:	6614102	Issue Dt:	09/02/2003	Application #:	09848864	Filing Dt:	05/04/2001
Title:	SHIELDED SEMICONDUCTOR LEADFRAME PACKAGE

Patent #:	6620862	Issue Dt:	09/16/2003	Application #:	09851564	Filing Dt:	05/08/2001
Publication #:	US20020001688	Pub Dt:	01/03/2002
Title:	SHEET RESIN COMPOSITION

Patent #:	6586677	Issue Dt:	07/01/2003	Application #:	09863359	Filing Dt:	05/22/2001
Publication #:	US20020027010	Pub Dt:	03/07/2002
Title:	PLASTIC INTEGRATED CIRCUIT DEVICE PACKAGE HAVING EXPOSED LEAD SURFACE

Patent #:	6429513	Issue Dt:	08/06/2002	Application #:	09866100	Filing Dt:	05/25/2001
Title:	ACTIVE HEAT SINK FOR COOLING A SEMICONDUCTOR CHIP

Patent #:	6670551	Issue Dt:	12/30/2003	Application #:	09871993	Filing Dt:	06/04/2001
Publication #:	US20020048842	Pub Dt:	04/25/2002
Title:	IMAGE SENSING COMPONENT PACKAGE AND MANUFACTURE METHOD THEREOF

Patent #:	6632997	Issue Dt:	10/14/2003	Application #:	09880277	Filing Dt:	06/13/2001
Publication #:	US20030000722	Pub Dt:	01/02/2003
Title:	PERSONALIZED CIRCUIT MODULE PACKAGE AND METHOD FOR PACKAGING CIRCUIT MODULES

Patent #:	6627987	Issue Dt:	09/30/2003	Application #:	09881343	Filing Dt:	06/13/2001
Title:	HERMETIC CERAMIC SEMICONDUCTOR PACKAGE

Patent #:	6586826	Issue Dt:	07/01/2003	Application #:	09881344	Filing Dt:	06/13/2001
Title:	INTEGRATED CIRCUIT PACKAGE HAVING POSTS FOR CONNECTION TO OTHER PACKAGES AND SUBSTRATES

Patent #:	6417576	Issue Dt:	07/09/2002	Application #:	09884357	Filing Dt:	06/18/2001
Title:	METHOD AND APPARATUS FOR ATTACHING MULTIPLE METAL COMPONENTS TO INTEGRATED CIRCUIT MODULES

Patent #:	6660559	Issue Dt:	12/09/2003	Application #:	09888950	Filing Dt:	06/25/2001
Title:	METHOD OF MAKING A CHIP CARRIER PACKAGE USING LASER ABLATION

Patent #:	6534338	Issue Dt:	03/18/2003	Application #:	09895767	Filing Dt:	06/29/2001
Title:	METHOD FOR MOLDING SEMICONDUCTOR PACKAGE HAVING A CERAMIC SUBSTRATE

Patent #:	6548759	Issue Dt:	04/15/2003	Application #:	09895994	Filing Dt:	06/28/2001
Title:	PRE-DRILLED IMAGE SENSOR PACKAGE

Patent #:	6661080	Issue Dt:	12/09/2003	Application #:	09895996	Filing Dt:	06/28/2001
Title:	STRUCTURE FOR BACKSIDE SAW CAVITY PROTECTION

Patent #:	6657298	Issue Dt:	12/02/2003	Application #:	09909160	Filing Dt:	07/18/2001
Title:	INTEGRATED CIRCUIT CHIP PACKAGE HAVING AN INTERNAL LEAD

Patent #:	6586824	Issue Dt:	07/01/2003	Application #:	09916716	Filing Dt:	07/26/2001
Title:	REDUCED THICKNESS PACKAGED ELECTRONIC DEVICE

Patent #:	6399418	Issue Dt:	06/04/2002	Application #:	09916719	Filing Dt:	07/26/2001
Title:	METHOD FOR FORMING A REDUCED THICKNESS PACKAGED ELECTRONIC DEVICE

Patent #:	6486545	Issue Dt:	11/26/2002	Application #:	09916848	Filing Dt:	07/26/2001
Title:	PRE-DRILLED BALL GRID ARRAY PACKAGE

Patent #:	6577012	Issue Dt:	06/10/2003	Application #:	09929239	Filing Dt:	08/13/2001
Title:	LASER DEFINED PADS FOR FLIP CHIP ON LEADFRAME PACKAGE

Patent #:	6593545	Issue Dt:	07/15/2003	Application #:	09929428	Filing Dt:	08/13/2001
Title:	LASER DEFINED PADS FOR FLIP CHIP ON LEADFRAME PACKAGE FABRICATION METHOD

Patent #:	6476476	Issue Dt:	11/05/2002	Application #:	09932109	Filing Dt:	08/16/2001
Title:	INTEGRATED CIRCUIT PACKAGE INCLUDING PIN AND BARREL INTERCONNECTS

Patent #:	6534391	Issue Dt:	03/18/2003	Application #:	09932528	Filing Dt:	08/17/2001
Title:	SEMICONDUCTOR PACKAGE HAVING SUBSTRATE WITH LASER-FORMED APERTURE THROUGH SOLDER MASK LAYER

Patent #:	6570825	Issue Dt:	05/27/2003	Application #:	09934040	Filing Dt:	08/21/2001
Publication #:	US20030043551	Pub Dt:	03/06/2003
Title:	METHOD AND CIRCUIT MODULE PACKAGE FOR AUTOMATED SWITCH ACTUATOR INSERTION

Patent #:	6603183	Issue Dt:	08/05/2003	Application #:	09946750	Filing Dt:	09/04/2001
Title:	QUICK SEALING GLASS-LIDDED PACKAGE

Patent #:	6396130	Issue Dt:	05/28/2002	Application #:	09953422	Filing Dt:	09/14/2001
Title:	SEMICONDUCTOR PACKAGE HAVING MULTIPLE DIES WITH INDEPENDENTLY BIASED BACK SURFACES

Patent #:	6555917	Issue Dt:	04/29/2003	Application #:	09974541	Filing Dt:	10/09/2001
Title:	SEMICONDUCTOR PACKAGE HAVING STACKED SEMICONDUCTOR CHIPS AND METHOD OF MAKING THE SAME

Patent #:	6611047	Issue Dt:	08/26/2003	Application #:	09976866	Filing Dt:	10/12/2001
Publication #:	US20030073265	Pub Dt:	04/17/2003
Title:	SEMICONDUCTOR PACKAGE WITH SINGULATION CREASE

Patent #:	6608497	Issue Dt:	08/19/2003	Application #:	09978535	Filing Dt:	10/15/2001
Title:	APPARATUS AND METHOD FOR ALLOWING TESTING OF SEMICONDUCTOR DEVICES AT DIFFERENT TEMPERATURES

Patent #:	6605865	Issue Dt:	08/12/2003	Application #:	09998844	Filing Dt:	10/19/2001
Publication #:	US20020130400	Pub Dt:	09/19/2002
Title:	SEMICONDUCTOR PACKAGE WITH OPTIMIZED LEADFRAME BONDING STRENGTH

Patent #:	6507102	Issue Dt:	01/14/2003	Application #:	10006642	Filing Dt:	12/05/2001
Publication #:	US20020043402	Pub Dt:	04/18/2002
Title:	PRINTED CIRCUIT BOARD WITH INTEGRAL HEAT SINK FOR SEMICONDUCTOR PACKAGE

Patent #:	6630726	Issue Dt:	10/07/2003	Application #:	10008048	Filing Dt:	11/07/2001
Title:	POWER SEMICONDUCTOR PACKAGE WITH STRAP

Patent #:	6630661	Issue Dt:	10/07/2003	Application #:	10012378	Filing Dt:	12/12/2001
Title:	SENSOR MODULE WITH INTEGRATED DISCRETE COMPONENTS

Patent #:	6670698	Issue Dt:	12/30/2003	Application #:	10068717	Filing Dt:	02/05/2002
Title:	INTEGRATED CIRCUIT PACKAGE MOUNTING

Patent #:	6576998	Issue Dt:	06/10/2003	Application #:	10086293	Filing Dt:	02/28/2002
Title:	THIN SEMICONDUCTOR PACKAGE WITH SEMICONDUCTOR CHIP AND ELECTRONIC DISCRETE DEVICE

Patent #:	6509637	Issue Dt:	01/21/2003	Application #:	10094731	Filing Dt:	03/08/2002
Title:	LOW PROFILE MOUNTING OF THICK INTEGRATED CIRCUIT PACKAGES WITHIN LOW-PROFILE CIRCUIT MODULES

Patent #:	6608366	Issue Dt:	08/19/2003	Application #:	10122598	Filing Dt:	04/15/2002
Title:	LEAD FRAME WITH PLATED END LEADS AND RECESSES

Patent #:	6627977	Issue Dt:	09/30/2003	Application #:	10142222	Filing Dt:	05/09/2002
Title:	SEMICONDUCTOR PACKAGE INCLUDING ISOLATED RING STRUCTURE

Patent #:	6630728	Issue Dt:	10/07/2003	Application #:	10171702	Filing Dt:	06/14/2002
Publication #:	US20020148630	Pub Dt:	10/17/2002
Title:	PLASTIC INTEGRATED CIRCUIT PACKAGE AND LEADFRAME FOR MAKING THE PACKAGE

Patent #:	6650019	Issue Dt:	11/18/2003	Application #:	10224864	Filing Dt:	08/20/2002
Publication #:	US20020195624	Pub Dt:	12/26/2002
Title:	METHOD OF MAKING A SEMICONDUCTOR PACKAGE INCLUDING STACKED SEMICONDUCTOR DIES

Patent #:	6646290	Issue Dt:	11/11/2003	Application #:	10227054	Filing Dt:	08/23/2002
Title:	OPTIC SEMICONDUCTOR PACKAGE

Assignor

CITICORP NORTH AMERICA, INC.

Exec Dt:

11/28/2005

Assignee

AMKOR TECHNOLOGY, INC.

1900 SOUTH PRICE ROAD

CHANDLER, ARIZONA 85248

Correspondence name and address
	CATHRYN A. BERRYMAN
	JENKENS & GILCHRIST
	1445 ROSS AVENUE, SUITE 3700
	DALLAS, TX 75202

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