Patent Assignment Details
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Reel/Frame: | 058178/0869 | |
| Pages: | 3 |
| | Recorded: | 11/22/2021 | | |
Attorney Dkt #: | M1295.70256US01 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17199237
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Filing Dt:
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03/11/2021
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Publication #:
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Pub Dt:
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07/01/2021
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Title:
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SEMICONDUCTOR PACKAGE USING FLIP-CHIP TECHNOLOGY
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Assignee
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NO. 1, DUSING RD. 1ST |
SCIENCE-BASED INDUSTRIAL PARK |
HSIN-CHU 300, TAIWAN R.O.C. |
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Correspondence name and address
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JIE XIANG
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WOLF, GREENFIELD & SACKS, P.C.
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600 ATLANTIC AVENUE
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BOSTON, MA 02210
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05/26/2024 04:14 PM
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