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Patent Assignment Details

NOTE:Results display only for issued patents and published applications. For pending or abandoned applications please consult USPTO staff.

Reel/Frame:	016547/0870			Pages:	2
		Recorded:	05/16/2005
Conveyance:	RELEASE BY SECURED PARTY (SEE DOCUMENT FOR DETAILS).

Total properties: 51

Patent #:	4670770	Issue Dt:	06/02/1987	Application #:	06582079	Filing Dt:	02/17/1984
Title:	INTEGRATED CIRCUIT CHIP AND SUBSTRATE ASSEMBLY

Patent #:	4703288	Issue Dt:	10/27/1987	Application #:	06719533	Filing Dt:	04/03/1985
Title:	INTERCONNECTION LINES FOR WAFER-SCALE-INTEGRATED ASSEMBLIES

Patent #:	4745548	Issue Dt:	05/17/1988	Application #:	07009634	Filing Dt:	01/23/1987
Title:	DECENTRALIZED BUS ARBITRATION USING DISTRIBUTED ARBITERS HAVING CIRCUITRY FOR LATCHING LOCKOUT SIGNALS GATE FROM HIGHER PRIORITY ARBITERS

Patent #:	4896937	Issue Dt:	01/30/1990	Application #:	07227220	Filing Dt:	08/02/1988
Title:	OPTICAL FIBER SWITCH

Patent #:	4995695	Issue Dt:	02/26/1991	Application #:	07394911	Filing Dt:	08/17/1989
Title:	OPTICAL ASSEMBLY COMPRISING OPTICAL FIBER COUPLING MEANS

Patent #:	5000532	Issue Dt:	03/19/1991	Application #:	07431941	Filing Dt:	11/06/1989
Title:	OPTICAL FIBER SWITCH

Patent #:	5043794	Issue Dt:	08/27/1991	Application #:	07587308	Filing Dt:	09/24/1990
Title:	INTEGRATED CIRCUIT PACKAGE AND COMPACT ASSEMBLIES THEREOF

Patent #:	5150832	Issue Dt:	09/29/1992	Application #:	07724561	Filing Dt:	06/28/1991
Title:	SOLDER PASTE

Patent #:	5125560	Issue Dt:	06/30/1992	Application #:	07787290	Filing Dt:	11/04/1991
Title:	METHOD OF SOLDERING INCLUDING REMOVAL OF FLUX RESIDUE

Patent #:	5197654	Issue Dt:	03/30/1993	Application #:	07792559	Filing Dt:	11/15/1991
Title:	BONDING METHOD USING SOLDER COMPOSED OF MULTIPLE ALTERNATING GOLD AND TIN LAYERS

Patent #:	5264107	Issue Dt:	11/23/1993	Application #:	07809694	Filing Dt:	12/17/1991
Title:	PSEUDO-ELECTROLESS, FOLLOWED BY ELECTROLESS, METALLIZATION OF NICKEL ON METALLIC WIRES, AS FOR SEMICONDUCTOR CHIP-TO-CHIP INTERCONNECTIONS

Patent #:	5234149	Issue Dt:	08/10/1993	Application #:	07938194	Filing Dt:	08/28/1992
Title:	DEBONDABLE METALLIC BONDING METHOD

Patent #:	5234153	Issue Dt:	08/10/1993	Application #:	07938195	Filing Dt:	08/28/1992
Title:	PERMANENT METALLIC BONDING METHOD

Patent #:	6077725	Issue Dt:	06/20/2000	Application #:	07940157	Filing Dt:	09/03/1992
Title:	METHOD FOR ASSEMBLING MULTICHIP MODULES

Patent #:	5211764	Issue Dt:	05/18/1993	Application #:	07973908	Filing Dt:	11/10/1992
Title:	SOLDER PASTE AND METHOD OF USING THE SAME

Patent #:	5307983	Issue Dt:	05/03/1994	Application #:	08054505	Filing Dt:	04/27/1993
Title:	METHOD OF MAKING AN ARTICLE COMPRISING SOLDER BUMP BONDING

Patent #:	5346118	Issue Dt:	09/13/1994	Application #:	08128492	Filing Dt:	09/28/1993
Title:	SURFACE MOUNT SOLDER ASSEMBLY OF LEADLESS INTEGRATED CIRCUIT PACKAGES TO SUBSTRATES

Patent #:	5385290	Issue Dt:	01/31/1995	Application #:	08158131	Filing Dt:	11/24/1993
Title:	SOLDERING MATERIAL AND PROCEDURE

Patent #:	5461333	Issue Dt:	10/24/1995	Application #:	08200986	Filing Dt:	02/24/1994
Title:	MULTI-CHIP MODULES HAVING CHIP-TO-CHIP INTERCONNECTIONS WITH REDUCED SIGNAL VOLTAGE LEVEL AND SWING

Patent #:	5382300	Issue Dt:	01/17/1995	Application #:	08216225	Filing Dt:	03/22/1994
Title:	SOLDER PASTE MIXTURE

Patent #:	5516728	Issue Dt:	05/14/1996	Application #:	08220771	Filing Dt:	03/31/1994
Title:	PROCESS FOR FABRICATING AN INTEGRATED CIRCUIT

Patent #:	5473512	Issue Dt:	12/05/1995	Application #:	08260859	Filing Dt:	06/16/1994
Title:	ELECTRONIC DEVICE PACKAGE HAVING ELECTRONIC DEVICE BONDED, AT A LOCALIZED REGION THEREOF, TO CIRCUIT BOARD

Patent #:	5505367	Issue Dt:	04/09/1996	Application #:	08333168	Filing Dt:	11/02/1994
Title:	METHOD FOR BUMPING SILICON DEVICES

Patent #:	5481205	Issue Dt:	01/02/1996	Application #:	08344393	Filing Dt:	11/23/1994
Title:	TEMPORARY CONNECTIONS FOR FAST ELECTRICAL ACCESS TO ELECTRONIC DEVICES

Patent #:	5534465	Issue Dt:	07/09/1996	Application #:	08370902	Filing Dt:	01/10/1995
Title:	METHOD FOR MAKING MULTICHIP CIRCUITS USING ACTIVE SEMICONDUCTOR SUBSTRATES

Patent #:	5608262	Issue Dt:	03/04/1997	Application #:	08393628	Filing Dt:	02/24/1995
Title:	PACKAGING MULTI-CHIP MODULES WITHOUT WIRE-BOND INTERCONNECTION

Patent #:	5622305	Issue Dt:	04/22/1997	Application #:	08438296	Filing Dt:	05/10/1995
Title:	BONDING SCHEME USING GROUP VB METALLIC LAYER

Patent #:	6029224	Issue Dt:	02/22/2000	Application #:	08477175	Filing Dt:	06/07/1995
Title:	SELF-CONTAINED MEMORY APPARATUS HAVING DIVERSE TYPES OF MEMORY AND DISTRIBUTED CONTROL

Patent #:	5564617	Issue Dt:	10/15/1996	Application #:	08479587	Filing Dt:	06/07/1995
Title:	METHOD AND APPARATUS FOR ASSEMBLING MULTICHIP MODULES

Patent #:	5699105	Issue Dt:	12/16/1997	Application #:	08534909	Filing Dt:	09/28/1995
Title:	CURBSIDE CIRCUITRY FOR INTERACTIVE COMMUNICATION SERVICES

Patent #:	5767447	Issue Dt:	06/16/1998	Application #:	08567659	Filing Dt:	12/05/1995
Title:	ELECTRONIC DEVICE PACKAGE ENCLOSED BY PLIANT MEDIUM LATERALLY CONFINED BY A PLASTIC RIM MEMBER

Patent #:	5834160	Issue Dt:	11/10/1998	Application #:	08586347	Filing Dt:	01/16/1996
Title:	METHOD AND APPARATUS FOR FORMING FINE PATTERNS ON PRINTED CIRCUIT BOARD

Patent #:	5646828	Issue Dt:	07/08/1997	Application #:	08697121	Filing Dt:	08/20/1996
Title:	THIN PACKAGING OF MULTI-CHIP MODULES WITH ENHANCED THERMAL POWER MANAGEMENT

Patent #:	5747982	Issue Dt:	05/05/1998	Application #:	08761047	Filing Dt:	12/05/1996
Title:	MULTI-CHIP MODULES WITH ISOLATED COUPLING BETWEEN MODULES

Patent #:	5778913	Issue Dt:	07/14/1998	Application #:	08803474	Filing Dt:	02/20/1997
Title:	CLEANING SOLDER-BONDED FLIP-CHIP ASSEMBLIES

Patent #:	5904859	Issue Dt:	05/18/1999	Application #:	08825923	Filing Dt:	04/02/1997
Title:	FLIP CHIP METALLIZATION

Patent #:	5990564	Issue Dt:	11/23/1999	Application #:	08866264	Filing Dt:	05/30/1997
Title:	FLIP CHIP PACKAGING OF MEMORY CHIPS

Patent #:	5869894	Issue Dt:	02/09/1999	Application #:	08896917	Filing Dt:	07/18/1997
Title:	RF IC PACKAGE

Patent #:	6020219	Issue Dt:	02/01/2000	Application #:	08939053	Filing Dt:	09/26/1997
Title:	METHOD OF PACKAGING FRAGILE DEVICES WITH A GEL MEDIUM CONFINED BY A RIM MEMBER

Patent #:	5898223	Issue Dt:	04/27/1999	Application #:	08946980	Filing Dt:	10/08/1997
Title:	CHIP-ON-CHIP IC PACKAGES

Patent #:	6043670	Issue Dt:	03/28/2000	Application #:	08991867	Filing Dt:	12/16/1997
Title:	METHOD FOR TESTING INTEGRATED CIRCUITS

Patent #:	6075427	Issue Dt:	06/13/2000	Application #:	09012304	Filing Dt:	01/23/1998
Title:	MCM WITH HIGH Q OVERLAPPING RESONATOR

Patent #:	6015652	Issue Dt:	01/18/2000	Application #:	09032338	Filing Dt:	02/27/1998
Title:	MANUFACTURE OF FLIP-CHIP DEVICE

Patent #:	6013877	Issue Dt:	01/11/2000	Application #:	09041157	Filing Dt:	03/12/1998
Title:	SOLDER BONDING PRINTED CIRCUIT BOARDS

Patent #:	6100475	Issue Dt:	08/08/2000	Application #:	09067271	Filing Dt:	04/27/1998
Title:	SOLDER BONDING PRINTED CIRCUIT BOARDS

Patent #:	5966903	Issue Dt:	10/19/1999	Application #:	09085643	Filing Dt:	05/27/1998
Title:	HIGH SPEED FLIP-CHIP DISPENSING

Patent #:	6154370	Issue Dt:	11/28/2000	Application #:	09120148	Filing Dt:	07/21/1998
Title:	RECESSED FLIP-CHIP PACKAGE

Patent #:	6205745	Issue Dt:	03/27/2001	Application #:	09134843	Filing Dt:	08/14/1998
Title:	HIGH SPEED FLIP-CHIP DISPENSING

Patent #:	6160715	Issue Dt:	12/12/2000	Application #:	09149804	Filing Dt:	09/08/1998
Title:	TRANSLATOR FOR RECESSED FLIP-CHIP PACKAGE

Patent #:	6074897	Issue Dt:	06/13/2000	Application #:	09238706	Filing Dt:	01/28/1999
Title:	INTEGRATED CIRCUIT BONDING METHOD AND APPARATUS

Patent #:	5646282	Issue Dt:		Application #:	UNAVAILABLE	Filing Dt:
Title:

Assignor

SILICON VALLEY BANK

Exec Dt:

04/15/2005

Assignee

SYCHIP, INC.

2805 NORTH DALLAS PKWY STE 400

PLANO, TEXAS 75093

Correspondence name and address
	SILICON VALLEY BANK
	LOAN DOCUMENTATION HA 155
	3003 TASMAN DR.
	SANTA CLARA, CA 95054

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