Total properties:
71
|
|
Patent #:
|
|
Issue Dt:
|
05/28/2002
|
Application #:
|
09493168
|
Filing Dt:
|
01/28/2000
|
Title:
|
SEMICONDUCTOR DEVICE
|
|
|
Patent #:
|
|
Issue Dt:
|
05/15/2001
|
Application #:
|
09493250
|
Filing Dt:
|
01/28/2000
|
Title:
|
Semiconductor device of chip-on-chip structure and semiconductor chip for use therein
|
|
|
Patent #:
|
|
Issue Dt:
|
09/09/2003
|
Application #:
|
09496183
|
Filing Dt:
|
02/02/2000
|
Publication #:
|
|
Pub Dt:
|
02/14/2002
| | | | |
Title:
|
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR CHIP FOR USE THEREIN
|
|
|
Patent #:
|
|
Issue Dt:
|
06/11/2002
|
Application #:
|
09496191
|
Filing Dt:
|
02/02/2000
|
Title:
|
A SEMICONDUCTOR DEVICE HAVING A CHIP-ON-CHIP STRUCTURE
|
|
|
Patent #:
|
|
Issue Dt:
|
06/11/2002
|
Application #:
|
09497157
|
Filing Dt:
|
02/03/2000
|
Title:
|
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
|
|
|
Patent #:
|
|
Issue Dt:
|
04/20/2004
|
Application #:
|
09499384
|
Filing Dt:
|
02/07/2000
|
Title:
|
SEMICONDUCTOR CHIP AND PRODUCTION THEREOF, AND SEMICONDUCTOR DEVICE HAVING SEMICONDUCTOR CHIP BONDED TO SOLID DEVICE
|
|
|
Patent #:
|
|
Issue Dt:
|
11/05/2002
|
Application #:
|
09499579
|
Filing Dt:
|
02/07/2000
|
Title:
|
SEMICONDUCTOR CHIP FOR CHIP-ON-CHIP STRUCTURE
|
|
|
Patent #:
|
|
Issue Dt:
|
12/02/2003
|
Application #:
|
09499580
|
Filing Dt:
|
02/07/2000
|
Title:
|
SEMICONDUCTOR CHIP AND SEMICONDUCTOR DEVICE OF CHIP-ON-CHIP STRUCTURE
|
|
|
Patent #:
|
|
Issue Dt:
|
04/09/2002
|
Application #:
|
09500462
|
Filing Dt:
|
02/09/2000
|
Title:
|
SEMICONDUCTOR DEVICE
|
|
|
Patent #:
|
|
Issue Dt:
|
10/08/2002
|
Application #:
|
09502433
|
Filing Dt:
|
02/11/2000
|
Publication #:
|
|
Pub Dt:
|
05/16/2002
| | | | |
Title:
|
SEMICONDUCTOR CHIP AND SEMICONDUCTOR DEVICE HAVING A CHIP-ON-CHIP STRUCTURE
|
|
|
Patent #:
|
|
Issue Dt:
|
03/12/2002
|
Application #:
|
09504856
|
Filing Dt:
|
02/16/2000
|
Title:
|
SEMICONDUCTOR CHIP
|
|
|
Patent #:
|
|
Issue Dt:
|
05/21/2002
|
Application #:
|
09511106
|
Filing Dt:
|
02/23/2000
|
Title:
|
METHOD OF FORMING THROUGH-HOLES IN A WAFER AND THEN DICING TO FORM STACKED SEMICONDUCTOR DEVICES
|
|
|
Patent #:
|
|
Issue Dt:
|
07/23/2002
|
Application #:
|
09511107
|
Filing Dt:
|
02/23/2000
|
Title:
|
SEMICONDUCTOR DEVICE HAVING CHIP-ON-CHIP STRUCTURE AND SEMICONDUCTOR CHIP USED THEREFOR
|
|
|
Patent #:
|
|
Issue Dt:
|
04/06/2004
|
Application #:
|
09511108
|
Filing Dt:
|
02/23/2000
|
Title:
|
SEMICONDUCTOR DEVICE HAVING A PRIMARY CHIP WITH BUMPS IN JOINED REGISTRATION WITH BUMPS OF A PLURALITY OF SECONDARY CHIPS
|
|
|
Patent #:
|
|
Issue Dt:
|
06/11/2002
|
Application #:
|
09512061
|
Filing Dt:
|
02/24/2000
|
Title:
|
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR CHIP
|
|
|
Patent #:
|
|
Issue Dt:
|
04/23/2002
|
Application #:
|
09512337
|
Filing Dt:
|
02/24/2000
|
Title:
|
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR CHIP
|
|
|
Patent #:
|
|
Issue Dt:
|
06/26/2001
|
Application #:
|
09515670
|
Filing Dt:
|
02/29/2000
|
Title:
|
Method of fabricating semiconductor device
|
|
|
Patent #:
|
|
Issue Dt:
|
01/08/2002
|
Application #:
|
09517283
|
Filing Dt:
|
03/02/2000
|
Title:
|
Multichip semiconductor device
|
|
|
Patent #:
|
|
Issue Dt:
|
09/10/2002
|
Application #:
|
09520312
|
Filing Dt:
|
03/07/2000
|
Publication #:
|
|
Pub Dt:
|
02/14/2002
| | | | |
Title:
|
MULTI-LAYERED INTEGRATED SEMICONDUCTOR DEVICE INCORPORATING ELECTRICALLY CONNECTED INTEGRATED CIRCUIT CHIPS AND MONITORING PADS
|
|
|
Patent #:
|
|
Issue Dt:
|
04/23/2002
|
Application #:
|
09546172
|
Filing Dt:
|
04/11/2000
|
Title:
|
PRODUCTION OF SEMICONDUCTOR DEVICE
|
|
|
Patent #:
|
|
Issue Dt:
|
01/15/2002
|
Application #:
|
09583539
|
Filing Dt:
|
06/01/2000
|
Title:
|
Semiconductor integrated circuit device with enhanced protection from electrostatic breakdown
|
|
|
Patent #:
|
|
Issue Dt:
|
03/22/2005
|
Application #:
|
09588628
|
Filing Dt:
|
06/07/2000
|
Title:
|
SEMICONDUCTOR CHIP WITH EXTERNAL CONNECTING TERMINAL
|
|
|
Patent #:
|
|
Issue Dt:
|
10/01/2002
|
Application #:
|
09612480
|
Filing Dt:
|
07/07/2000
|
Title:
|
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THEREOF
|
|
|
Patent #:
|
|
Issue Dt:
|
06/01/2004
|
Application #:
|
09665663
|
Filing Dt:
|
09/20/2000
|
Title:
|
SEMICONDUCTOR CHIP AND METHOD OF PRODUCING THE SAME
|
|
|
Patent #:
|
|
Issue Dt:
|
04/13/2004
|
Application #:
|
09702870
|
Filing Dt:
|
11/01/2000
|
Title:
|
SEMICONDUCTOR DEVICE OF CHIP-ON-CHIP STRUCTURE WITH A RADIOTION NOISE SHIELD
|
|
|
Patent #:
|
|
Issue Dt:
|
10/21/2003
|
Application #:
|
09704563
|
Filing Dt:
|
11/03/2000
|
Title:
|
METHOD OF PRODUCING A SEMICONDUCTOR DEVICE BY DIVIDING A SEMICONDUCTOR WAFER INTO SEPARATE PIECES OF SEMICONDUCTOR CHIPS
|
|
|
Patent #:
|
|
Issue Dt:
|
08/17/2004
|
Application #:
|
09814057
|
Filing Dt:
|
03/22/2001
|
Publication #:
|
|
Pub Dt:
|
01/24/2002
| | | | |
Title:
|
SEMICONDUCTOR DEVICE WITH WARP PREVENTING BOARD JOINED THERETO
|
|
|
Patent #:
|
|
Issue Dt:
|
10/31/2006
|
Application #:
|
09830092
|
Filing Dt:
|
06/27/2001
|
Title:
|
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
|
|
|
Patent #:
|
|
Issue Dt:
|
10/21/2003
|
Application #:
|
09950058
|
Filing Dt:
|
09/12/2001
|
Publication #:
|
|
Pub Dt:
|
03/14/2002
| | | | |
Title:
|
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
|
|
|
Patent #:
|
|
Issue Dt:
|
07/01/2003
|
Application #:
|
09982851
|
Filing Dt:
|
10/22/2001
|
Publication #:
|
|
Pub Dt:
|
07/18/2002
| | | | |
Title:
|
SEMICONDUCTOR DEVICE AND FABRICATION PROCESS THEREFOR
|
|
|
Patent #:
|
|
Issue Dt:
|
05/11/2004
|
Application #:
|
10088163
|
Filing Dt:
|
03/15/2002
|
Publication #:
|
|
Pub Dt:
|
10/17/2002
| | | | |
Title:
|
SEMICONDUCTOR DEVICE WITH CHIP-ON-CHIP CONSTRUCTION JOINED VIA A LOW-MELTING POINT METAL LAYER
|
|
|
Patent #:
|
|
Issue Dt:
|
09/15/2009
|
Application #:
|
10119936
|
Filing Dt:
|
04/11/2002
|
Publication #:
|
|
Pub Dt:
|
08/15/2002
| | | | |
Title:
|
SEMICONDUCTOR CHIP AND SEMICONDUCTOR DEVICE USING THE SAME, AND METHOD OF FABRICATING SEMICONDUCTOR CHIP
|
|
|
Patent #:
|
|
Issue Dt:
|
05/24/2005
|
Application #:
|
10145892
|
Filing Dt:
|
05/16/2002
|
Publication #:
|
|
Pub Dt:
|
09/12/2002
| | | | |
Title:
|
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
|
|
|
Patent #:
|
|
Issue Dt:
|
11/16/2004
|
Application #:
|
10192655
|
Filing Dt:
|
07/11/2002
|
Publication #:
|
|
Pub Dt:
|
01/16/2003
| | | | |
Title:
|
METHOD OF CUTTING A WAFER INTO INDIVIDUAL CHIPS
|
|
|
Patent #:
|
|
Issue Dt:
|
06/06/2006
|
Application #:
|
10193328
|
Filing Dt:
|
07/12/2002
|
Publication #:
|
|
Pub Dt:
|
01/16/2003
| | | | |
Title:
|
SEMICONDUCTOR DEVICE
|
|
|
Patent #:
|
|
Issue Dt:
|
03/22/2005
|
Application #:
|
10211308
|
Filing Dt:
|
08/05/2002
|
Publication #:
|
|
Pub Dt:
|
12/19/2002
| | | | |
Title:
|
SEMICONDUCTOR CHIP, CHIP-ON-CHIP STRUCTURE DEVICE, AND ASSEMBLING METHOD THEREOF
|
|
|
Patent #:
|
|
Issue Dt:
|
06/17/2008
|
Application #:
|
10246226
|
Filing Dt:
|
09/18/2002
|
Publication #:
|
|
Pub Dt:
|
04/03/2003
| | | | |
Title:
|
AUTHENTICATION SYSTEM HAVING A SEMICONDUCTOR DEVICE CONTAINING DATA WHICH ARE DIFFICULT TO ANALYZE THROUGH ILLEGITIMATE ACCESS, AND SEMICONDUCTOR DEVICE THEREFOR
|
|
|
Patent #:
|
|
Issue Dt:
|
11/09/2004
|
Application #:
|
10255958
|
Filing Dt:
|
09/27/2002
|
Publication #:
|
|
Pub Dt:
|
04/03/2003
| | | | |
Title:
|
SEMICONDUCTOR DEVICE HAVING OPPOSED AND CONNECTED SEMICONDUCTOR CHIPS WITH LATERAL DEVIATION CONFIRMING ELECTRODES
|
|
|
Patent #:
|
|
Issue Dt:
|
04/27/2004
|
Application #:
|
10255961
|
Filing Dt:
|
09/27/2002
|
Publication #:
|
|
Pub Dt:
|
04/03/2003
| | | | |
Title:
|
SEMICONDUCTOR DEVICE
|
|
|
Patent #:
|
|
Issue Dt:
|
09/21/2004
|
Application #:
|
10268626
|
Filing Dt:
|
10/10/2002
|
Publication #:
|
|
Pub Dt:
|
04/24/2003
| | | | |
Title:
|
SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING THE SAME
|
|
|
Patent #:
|
|
Issue Dt:
|
08/24/2004
|
Application #:
|
10274952
|
Filing Dt:
|
10/22/2002
|
Publication #:
|
|
Pub Dt:
|
04/24/2003
| | | | |
Title:
|
SEMICONDUCTOR DEVICE
|
|
|
Patent #:
|
|
Issue Dt:
|
03/15/2005
|
Application #:
|
10284318
|
Filing Dt:
|
10/31/2002
|
Publication #:
|
|
Pub Dt:
|
05/01/2003
| | | | |
Title:
|
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME
|
|
|
Patent #:
|
|
Issue Dt:
|
01/04/2005
|
Application #:
|
10314289
|
Filing Dt:
|
12/09/2002
|
Publication #:
|
|
Pub Dt:
|
07/03/2003
| | | | |
Title:
|
SEMICONDUCTOR DEVICE HAVING A PRIMARY CHIP WITH BUMPS IN JOINED REGISTRATION WITH BUMPS OF A PLURALITY OF SECONDARY CHIPS
|
|
|
Patent #:
|
|
Issue Dt:
|
08/30/2005
|
Application #:
|
10435041
|
Filing Dt:
|
05/12/2003
|
Publication #:
|
|
Pub Dt:
|
10/23/2003
| | | | |
Title:
|
SEMICONDUCTOR DEVICE AND FABRICATION PROCESS THEREFOR
|
|
|
Patent #:
|
|
Issue Dt:
|
11/03/2009
|
Application #:
|
10577450
|
Filing Dt:
|
04/27/2006
|
Publication #:
|
|
Pub Dt:
|
04/05/2007
| | | | |
Title:
|
ELECTRONIC DEVICE, SEMICONDUCTOR DEVICE USING SAME, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
|
|
|
Patent #:
|
|
Issue Dt:
|
10/24/2006
|
Application #:
|
10615876
|
Filing Dt:
|
07/10/2003
|
Publication #:
|
|
Pub Dt:
|
02/12/2004
| | | | |
Title:
|
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR CHIP FOR USE THEREIN
|
|
|
Patent #:
|
|
Issue Dt:
|
06/05/2007
|
Application #:
|
10626524
|
Filing Dt:
|
07/25/2003
|
Publication #:
|
|
Pub Dt:
|
08/03/2006
| | | | |
Title:
|
METHOD OF PRODUCING A SEMICONDUCTOR DEVICE BY DIVIDING A SEMICONDUCTOR WAFER INTO SEPARATE PIECES OF SEMICONDUCTOR CHIPS
|
|
|
Patent #:
|
|
Issue Dt:
|
12/28/2004
|
Application #:
|
10629904
|
Filing Dt:
|
07/30/2003
|
Publication #:
|
|
Pub Dt:
|
07/15/2004
| | | | |
Title:
|
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
|
|
|
Patent #:
|
|
Issue Dt:
|
08/08/2006
|
Application #:
|
10654919
|
Filing Dt:
|
09/05/2003
|
Publication #:
|
|
Pub Dt:
|
03/04/2004
| | | | |
Title:
|
SEMICONDUCTOR DEVICE FOR RADIO COMMUNICATION DEVICE, AND RADIO COMMUNICATION DEVICE USING SAID SEMICONDUCTOR DEVICE
|
|
|
Patent #:
|
|
Issue Dt:
|
07/24/2007
|
Application #:
|
10727577
|
Filing Dt:
|
12/05/2003
|
Publication #:
|
|
Pub Dt:
|
06/17/2004
| | | | |
Title:
|
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME
|
|
|
Patent #:
|
|
Issue Dt:
|
08/15/2006
|
Application #:
|
10754605
|
Filing Dt:
|
01/12/2004
|
Publication #:
|
|
Pub Dt:
|
07/22/2004
| | | | |
Title:
|
SEMICONDUCTOR DEVICE
|
|
|
Patent #:
|
|
Issue Dt:
|
06/10/2008
|
Application #:
|
10795994
|
Filing Dt:
|
03/10/2004
|
Publication #:
|
|
Pub Dt:
|
09/02/2004
| | | | |
Title:
|
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
|
|
|
Patent #:
|
|
Issue Dt:
|
05/16/2006
|
Application #:
|
10797018
|
Filing Dt:
|
03/11/2004
|
Publication #:
|
|
Pub Dt:
|
11/11/2004
| | | | |
Title:
|
SEMICONDUCTOR CHIP AND PRODUCTION THEREOF, AND SEMICONDUCTOR DEVICE HAVING SEMICONDUCTOR CHIP BONDED TO SOLID DEVICE
|
|
|
Patent #:
|
|
Issue Dt:
|
05/02/2006
|
Application #:
|
10805385
|
Filing Dt:
|
03/22/2004
|
Publication #:
|
|
Pub Dt:
|
09/09/2004
| | | | |
Title:
|
SEMICONDUCTOR CHIP AND METHOD OF PRODUCING THE SAME
|
|
|
Patent #:
|
|
Issue Dt:
|
12/13/2005
|
Application #:
|
10911458
|
Filing Dt:
|
08/04/2004
|
Publication #:
|
|
Pub Dt:
|
01/13/2005
| | | | |
Title:
|
SEMICONDUCTOR DEVICE MANUFACTURED WITH AUXILLARY MASK AND METHOD FOR PRODUCING THE SAME
|
|
|
Patent #:
|
|
Issue Dt:
|
02/20/2007
|
Application #:
|
10938533
|
Filing Dt:
|
09/13/2004
|
Publication #:
|
|
Pub Dt:
|
02/10/2005
| | | | |
Title:
|
SEMICONDUCTOR DEVICE WITH MULTI-STAGED CUT SIDE SURFACES
|
|
|
Patent #:
|
|
Issue Dt:
|
08/28/2007
|
Application #:
|
11053892
|
Filing Dt:
|
02/10/2005
|
Publication #:
|
|
Pub Dt:
|
07/07/2005
| | | | |
Title:
|
SEMICONDUCTOR CHIP WITH EXTERNAL CONNECTING TERMINAL
|
|
|
Patent #:
|
|
Issue Dt:
|
03/04/2008
|
Application #:
|
11053933
|
Filing Dt:
|
02/10/2005
|
Publication #:
|
|
Pub Dt:
|
07/07/2005
| | | | |
Title:
|
SEMICONDUCTOR CHIP WITH EXTERNAL CONNECTING TERMINAL
|
|
|
Patent #:
|
|
Issue Dt:
|
11/21/2006
|
Application #:
|
11053934
|
Filing Dt:
|
02/10/2005
|
Publication #:
|
|
Pub Dt:
|
07/07/2005
| | | | |
Title:
|
SEMICONDUCTOR CHIP WITH EXTERNAL CONNECTING TERMINAL
|
|
|
Patent #:
|
|
Issue Dt:
|
03/20/2007
|
Application #:
|
11122052
|
Filing Dt:
|
05/05/2005
|
Publication #:
|
|
Pub Dt:
|
11/03/2005
| | | | |
Title:
|
SEMICONDUCTOR DEVICE AND FABRICATION PROCESS THEREFOR
|
|
|
Patent #:
|
|
Issue Dt:
|
06/20/2006
|
Application #:
|
11249908
|
Filing Dt:
|
10/12/2005
|
Publication #:
|
|
Pub Dt:
|
02/16/2006
| | | | |
Title:
|
SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING THE SAME
|
|
|
Patent #:
|
|
Issue Dt:
|
03/30/2010
|
Application #:
|
11451400
|
Filing Dt:
|
06/13/2006
|
Publication #:
|
|
Pub Dt:
|
12/07/2006
| | | | |
Title:
|
SEMICONDUCTOR DEVICE HAVING A STACKED CHIP STRUCTURE
|
|
|
Patent #:
|
|
Issue Dt:
|
04/14/2009
|
Application #:
|
11637945
|
Filing Dt:
|
12/13/2006
|
Publication #:
|
|
Pub Dt:
|
06/28/2007
| | | | |
Title:
|
SEMICONDUCTOR CHIP AND SEMICONDUCTOR DEVICE
|
|
|
Patent #:
|
|
Issue Dt:
|
06/07/2011
|
Application #:
|
11794243
|
Filing Dt:
|
06/27/2007
|
Publication #:
|
|
Pub Dt:
|
01/24/2008
| | | | |
Title:
|
SEMICONDUCTOR CHIP AND METHOD FOR MANUFACTURING SAME, ELECTRODE STRUCTURE OF SEMICONDUCTOR CHIP AND METHOD FOR FORMING SAME, AND SEMICONDUCTOR DEVICE
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Patent #:
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Issue Dt:
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09/20/2011
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Application #:
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11921573
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Filing Dt:
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12/05/2007
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Publication #:
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Pub Dt:
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05/07/2009
| | | | |
Title:
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INTERPOSER AND SEMICONDUCTOR DEVICE
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Patent #:
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Issue Dt:
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02/18/2014
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Application #:
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11990875
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Filing Dt:
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02/22/2008
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Publication #:
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Pub Dt:
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05/21/2009
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Title:
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SEMICONDUCTOR CHIP, METHOD OF MANUFACTURING SEMICONDUCTOR CHIP, AND SEMICONDUCTOR DEVICE
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Patent #:
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Issue Dt:
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04/19/2011
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Application #:
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12339218
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Filing Dt:
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12/19/2008
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Publication #:
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Pub Dt:
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06/25/2009
| | | | |
Title:
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SEMICONDUCTOR DEVICE
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Patent #:
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Issue Dt:
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09/18/2012
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Application #:
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13095193
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Filing Dt:
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04/27/2011
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Publication #:
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Pub Dt:
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08/18/2011
| | | | |
Title:
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SEMICONDUCTOR CHIP, ELECTRODE STRUCTURE THEREFOR AND METHOD FOR FORMING SAME
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|
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Patent #:
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Issue Dt:
|
08/16/2016
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Application #:
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14716102
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Filing Dt:
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05/19/2015
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Publication #:
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Pub Dt:
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11/26/2015
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Title:
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SEMICONDUCTOR PACKAGE, PRINTED CIRCUIT BOARD SUBSTRATE AND SEMICONDUCTOR DEVICE
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Patent #:
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Issue Dt:
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07/04/2017
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Application #:
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15222162
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Filing Dt:
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07/28/2016
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Publication #:
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Pub Dt:
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11/17/2016
| | | | |
Title:
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SEMICONDUCTOR PACKAGE, PRINTED CIRCUIT BOARD SUBSTRATE AND SEMICONDUCTOR DEVICE
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|
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Patent #:
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|
Issue Dt:
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10/02/2018
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Application #:
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15616444
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Filing Dt:
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06/07/2017
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Publication #:
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Pub Dt:
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09/21/2017
| | | | |
Title:
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SEMICONDUCTOR PACKAGE, PRINTED CIRCUIT BOARD SUBSTRATE AND SEMICONDUCTOR DEVICE
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