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Reel/Frame:053279/0878   Pages: 3
Recorded: 07/22/2020
Attorney Dkt #:AIPT-108D1
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
05/31/2022
Application #:
16935625
Filing Dt:
07/22/2020
Publication #:
Pub Dt:
11/05/2020
Title:
LIGHT EMISSION DIODE WITH FLIP-CHIP STRUCTURE AND MANUFACTURING METHOD THEREOF
Assignors
1
Exec Dt:
07/15/2020
2
Exec Dt:
07/13/2020
3
Exec Dt:
07/11/2020
Assignee
1
NO.1001, DAXUE RD., EAST DIST.
HSINCHU CITY, TAIWAN 300
Correspondence name and address
RABIN & BERDO, P.C.
2650 PARK TOWER DRIVE, SUITE 800
VIENNA, VA 22180

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