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Patent Assignment Details
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Reel/Frame:020400/0880   Pages: 2
Recorded: 01/15/2008
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
NONE
Issue Dt:
Application #:
12007704
Filing Dt:
01/15/2008
Publication #:
Pub Dt:
07/16/2009
Title:
Method of making circuitized assembly including a plurality of circuitized substrates
Assignor
1
Exec Dt:
01/03/2008
Assignee
1
1095 CLARK STREET
ENDICOTT, NEW YORK 13760
Correspondence name and address
HINMAN, HOWARD & KATTELL, LLP
700 SECURITY MUTAL BUILDING
80 EXCHANGE STREET
BINGHAMTON, NY 13901

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