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Reel/Frame:034603/0881   Pages: 3
Recorded: 12/30/2014
Attorney Dkt #:2515.0241 CIP
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
02/26/2013
Application #:
12875981
Filing Dt:
09/03/2010
Publication #:
Pub Dt:
03/08/2012
Title:
SEMICONDUCTOR DEVICE AND METHOD OF FORMING INTERPOSER FRAME OVER SEMICONDUCTOR DIE TO PROVIDE VERTICAL INTERCONNECT
Assignors
1
Exec Dt:
10/29/2014
2
Exec Dt:
10/29/2014
Assignee
1
10 ANG MO KIO STREET 65
#05-17/20 TECHPOINT
SINGAPORE, SINGAPORE 569059
Correspondence name and address
PATENT LAW GROUP: ATKINS AND ASSOCIATES
55 N. ARIZONA PLACE
SUITE 104
CHANDLER, AZ 85225

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