Patent Assignment Details
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Reel/Frame: | 017701/0882 | |
| Pages: | 4 |
| | Recorded: | 03/17/2006 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11377425
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Filing Dt:
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03/17/2006
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Publication #:
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Pub Dt:
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10/05/2006
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Title:
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Ball grid array package and process for manufacturing same
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Assignee
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QPL INDUSTRIAL BUILDING, 14TH FLOOR, 138 TEXAN RD |
TSUEN WAN, NEW TERRITORIES, HONG KONG |
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Correspondence name and address
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MAYER, BROWN, ROWE & MAW LLP
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1909 K STREET, N.W.
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WASHINGTON, DC 20006
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06/14/2024 01:46 AM
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