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Reel/Frame:027650/0882   Pages: 4
Recorded: 02/03/2012
Attorney Dkt #:83778-762954 (034000US)
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
NONE
Issue Dt:
Application #:
12403294
Filing Dt:
03/12/2009
Publication #:
Pub Dt:
09/16/2010
Title:
Premolded Substrates with Apertures for Semiconductor Die Packages with Stacked Dice, Said Packages, and Methods of Making the Same
Assignors
1
Exec Dt:
03/11/2009
2
Exec Dt:
03/11/2009
3
Exec Dt:
03/12/2009
Assignee
1
82 RUNNING HILL ROAD
SOUTH PORTLAND, MAINE 04106
Correspondence name and address
KILPATRICK TOWNSEND & STOCKTON LLP
TWO EMBARCADERO CENTER
EIGHTH FLOOR
SAN FRANCISCO, CA 94111

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