Patent Assignment Details
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| Reel/Frame: | 064371/0886 | |
| Pages: | 5 |
| | Recorded: | 07/25/2023 | | |
| Attorney Dkt #: | GBHJL011 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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04/30/2024
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Application #:
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17667734
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Filing Dt:
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02/09/2022
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Publication #:
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Pub Dt:
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05/19/2022
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Title:
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DEVICES AND METHODS OF VERTICAL INTEGRATIONS OF SEMICONDUCTOR CHIPS, MAGNETIC CHIPS, AND LEAD FRAMES
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Assignee
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| 2-B-703, BLOCK 2B, CREATIVE INDUSTRY PARK, NO. 328, XINGHU STREET, SUZHOU INDUSTRIAL PARK, (JIANGSU) PILOT FREE TRADE ZONE |
| SUZHOU, CHINA |
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Correspondence name and address
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GOKALP BAYRAMOGLU
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1540 WEST WARM SPRINGS RD., SUITE 100 HENDERSON
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HENDERSON, NV 89014
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