Patent Assignment Details
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| Reel/Frame: | 041049/0889 | |
| Pages: | 2 |
| | Recorded: | 01/23/2017 | | |
| Attorney Dkt #: | 5481/0178PUS1 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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06/05/2018
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Application #:
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15410430
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Filing Dt:
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01/19/2017
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Title:
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SEMICONDUCTOR STRUCTURE WITH THROUGH SUBSTRATE VIA AND MANUFACTURING METHOD THEREOF
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Assignee
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| NO. 669, FUSING 3RD RD., GUEISHAN DIST., |
| TAOYUAN CITY, TAIWAN 333 |
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Correspondence name and address
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MUNCY, GEISSLER, OLDS & LOWE, PC
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4000 LEGATO RD., SUITE 310
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FAIRFAX, VA 22033
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06/04/2024 05:43 AM
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