Patent Assignment Details
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| Reel/Frame: | 022101/0891 | |
| Pages: | 2 |
| | Recorded: | 01/13/2009 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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12316758
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Filing Dt:
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12/16/2008
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Publication #:
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Pub Dt:
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11/05/2009
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Title:
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Liquid cooling heat dissipating device
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Assignee
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| 8F, 88, SEC. 1, HSIN TAI WU RD. |
| HSICHIH |
| TAIPEI HSIEN, TAIWAN R.O.C. 221 |
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Correspondence name and address
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DANIEL J. HUDAK
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HUDAK, SHUNK & FARINE CO LPA
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2020 FRONT STREET, SUITE 307
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CUYAHOGA FALLS, OHIO 44221
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