Patent Assignment Details
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Reel/Frame: | 020735/0896 | |
| Pages: | 4 |
| | Recorded: | 03/28/2008 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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11/24/2009
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Application #:
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12025623
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Filing Dt:
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02/04/2008
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Publication #:
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Pub Dt:
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08/06/2009
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Title:
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WAFER PROCESSING INCLUDING DICING
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Assignee
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8000 S. FEDERAL WAY |
BOISE, IDAHO 83716-9632 |
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Correspondence name and address
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BROOKS, CAMERON & HUEBSCH, PLLC
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1221 NICOLLET AVENUE
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SUITE 500
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MINNEAPOLIS, MN 55403
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