Patent Assignment Details
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Reel/Frame: | 026557/0899 | |
| Pages: | 3 |
| | Recorded: | 07/07/2011 | | |
Attorney Dkt #: | 1248/277A |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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04/02/2013
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Application #:
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13178375
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Filing Dt:
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07/07/2011
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Publication #:
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Pub Dt:
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12/13/2012
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Title:
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CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
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Assignee
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9F., NO. 23, JILIN RD., JHONGLI INDUSTRIAL PARK |
JHONGLI CITY, TAOYUAN COUNTRY, TAIWAN 32062 |
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Correspondence name and address
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WEN LIU
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444 S. FLOWER STREET, SUITE 1750
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LOS ANGELES, CA 90071
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