Patent Assignment Details
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| Reel/Frame: | 051663/0899 | |
| Pages: | 3 |
| | Recorded: | 01/29/2020 | | |
| Attorney Dkt #: | 19-2320 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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05/24/2022
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Application #:
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16721277
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Filing Dt:
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12/19/2019
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Publication #:
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Pub Dt:
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06/25/2020
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Title:
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Integrated Circuit with an Interconnection System having a Multilevel Layer Providing Multilevel Routing Tracks and Method of Manufacturing the Same
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Assignee
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| KAPELDREEF 75 |
| LEUVEN, BELGIUM 3001 |
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Correspondence name and address
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MCDONNELL BOEHNEN HULBERT & BERGHOFF LLP
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300 SOUTH WACKER DRIVE
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3100
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CHICAGO, IL 60606
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06/17/2024 10:28 PM
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