Patent Assignment Details
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| Reel/Frame: | 039289/0901 | |
| Pages: | 4 |
| | Recorded: | 07/29/2016 | | |
| Attorney Dkt #: | 11948.16 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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09/11/2007
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Application #:
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10379979
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Filing Dt:
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03/04/2003
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Publication #:
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Pub Dt:
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11/13/2003
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Title:
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SEMICONDUCTOR PACKAGE HAVING SOLDER JOINT OF IMPROVED RELIABILITY
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Assignee
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| 55, PYEONGCHEON-RO 850 BEON-GIL, |
| WONMI-GU, BUCHEON-SI |
| GYEONGGI-DO, KOREA, REPUBLIC OF |
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Correspondence name and address
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KENNETH E. HORTON
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36 S. STATE STREET, STE 1900
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KEY BANK TOWER
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SALT LAKE CITY, UT 84111
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